WATERLOO, ON, June 11, 2012 /CNW/ - Terepac Corp., a pioneer in the
world's tiniest digital electronics, and Rockwell Automation have
engaged so Terepac can produce large volumes of its micro circuits for
the "Internet of Things" -- uniquely identifiable objects and their
virtual representations in an Internet-like structure that requires
radio frequency identification (RFID) as a prerequisite.
Based on the agreement, Rockwell Automation will support the
infrastructure that Terepac uses for its proprietary process, enabling
it to miniaturize significantly more circuits than its current
"Advanced manufacturing technology is rapidly transforming the global
competitive landscape, and Terepac is using its unique technology to
produce very small circuits," said Sujeet Chand, senior vice president
and chief technology officer, Rockwell Automation. "We have a unique
opportunity to help Terepac scale its breakthrough technology and
advance microelectronics to the next level."
"We're pleased to work with Rockwell Automation's highly qualified team
because they're a world leader in the delivery of industrial automation
solutions," said Terepac CEO Ric Asselstine. "They share our goal to
create extraordinary technology to give people everywhere more useful
information about the world around them."
In April Terepac announced the TereTag™, which allows virtually any
object to become part of the "Internet of Things". The tag, embedded
unobtrusively in its host, provides a wide range of capabilities to
identify, communicate, and operate with more security and efficiency.
"Giving an electronic voice to an almost limitless number and type of
objects can result in unpredecented gains in efficiency, insight and
organizational change," said Asselstine. "From health conditions to
energy efficiency to more optimized industrial processes, we are
learning the potential advances made possible by applying this
technology. We are delighted to have Rockwell Automation work with
About Terepac Corporation
Terepac Corporation, a pioneer in the burgeoning Internet of Things, has
developed a breakthrough semiconductor packaging and assembly method to
allow effective handling and packaging of the tiniest imaginable chips,
objects and electronic components - at its limit to the nanometer
scale. As a result, sophisticated microelectronics can be printed on
flexible substrates at a fraction of the size and cost of conventional
methods. Entire structures with microprocessors, memory and sensors can
be reduced to less than a millimeter square, thinner than paper, and
flexible enough to bend around a pencil - with no sacrifice in
Terepac makes it possible to significantly reduce the size and weight of
electronics in existing devices, and to introduce electronics into or
onto devices where previously not thought possible. The result is a new
category of electronics that "gives voice to the world" thereby
creating a novel window in to object condition and behaviour and an
entirely new source of managed and visualized "big data".
Terepac Corporation is privately held with headquarters in Waterloo,
Ontario, Canada. For more information, please visit www.terepac.com.
About Rockwell Automation
Rockwell Automation, Inc., the world's largest company dedicated to industrial automation and
information, makes its customers more productive and the world more
sustainable. Headquartered in Milwaukee, Wis., Rockwell Automation
employs about 21,000 people serving customers in more than 80
SOURCE Terepac Corporation
For further information:
CEO, Terepac Corp.