Spectra7 Announces Appointment Of Dr. Andrew Kim As CTO

Respected Ph.D. in Signal Processing from MIT Brings Proven Innovation

PALO ALTO, Calif. and TORONTO, April 3, 2013 /CNW/ - (TSX-V:SEV) Spectra7 Microsystems Inc. ("Spectra7"), a high performance analog semiconductor company delivering unprecedented speed, resolution and signal fidelity to consumer and wireless infrastructure products, officially welcomed Dr. Andrew Kim as Chief Technology Officer.

"We're delighted and honored to welcome Dr. Kim to the team," commented Tony Stelliga, CEO of Spectra7. "He's considered one of the great minds in signal processing and his expertise has already resulted in new patent pending techniques to deliver bandwidth at game-changing speeds and resolution."

Prior to joining Spectra7, Dr. Kim was a Senior Principal Systems Engineer at Intersil Corp. where he was instrumental in creating new system architectures and processing blocks for high-speed wireline products. Prior to that, he was a Senior Engineer at Samsung Electro-Mechanics Co. Ltd from 2008 to 2010 where he developed RF signal integrity solutions for spectrum sensing and interference cancellation applications. From 2001 to 2008, he was a Senior Systems Architect at Quellan Inc. where he developed signal integrity solutions for both wired and wireless high-speed channels.

Dr. Kim received his Ph.D. from the Massachusetts Institute of Technology for work in signal processing based on stochastic analysis. He has 21 granted patents and 10 pending in the field of signal integrity.

"It's well known throughout the industry there's a paradigm shift coming," commented Dr. Kim. "The increasing bandwidth and speeds required to deliver pristine content is set to overwhelm today's infrastructure and those organizations able to solve this dilemma will define the next generation of semiconductor companies."

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. (TSX-V: SEV) is a high performance analog semiconductor company delivering unprecedented speed, resolution and signal fidelity to consumer and wireless infrastructure products. Spectra7's new system level components address the bottlenecks and the exponential demand for more bandwidth and lower costs in mobile and internet infrastructure equipment, including handsets, tablets, base stations and microwave backhaul systems. For more information, please visit http://www.spectra7.com

Certain information in this news release may constitute forward-looking information. This information is based on current expectations that are subject to significant risks and uncertainties that are difficult to predict. Actual results might differ materially from results suggested in any forward-looking statements. Spectra7 assumes no obligation to update the forward-looking statements, or to update the reasons why actual results could differ from those reflected in the forward looking-statements unless and until required by securities laws applicable to Spectra7. Additional information identifying risks and uncertainties is contained in Spectra7's filings with the Canadian securities regulators available at www.sedar.com.

Neither the TSX-V nor its Regulation Services Provider (as that term is defined in the policies of the TSX-V) accepts responsibility for the adequacy or accuracy of this release.

SOURCE: Spectra7 Microsystems Inc.

For further information:

Robert Munro, Communications, [phone], ext. 269, [email protected]

http://www.spectra7.com