Gennum Presents its New Portfolio of Highly Integrated Module ICs at OFC

Gennum Solutions Now Address 10 Gig EPON, Fibre Channel, and Ethernet Platforms

BURLINGTON, ON, March 18 /CNW/ - Gennum Corporation (TSX:GND) announced its presence at the Optical Fiber Communication Conference & Exhibition (OFC), to be held at the San Diego Convention Center from March 23 - 25, 2010. Gennum will be demonstrating its newest products for the optical networking market live at booth No. 203.

Gennum's growing portfolio of optical solutions addresses the increasing demands of the optical networking market, including highly integrated products to address power, performance and space constraints. Gennum's broad product portfolio now addresses both the 10 Gig SFP+ market, with its analog signal integrity solutions, as well as the 10 Gig EPON, Ethernet and Fibre Channel markets with its new highly integrated digital solutions. Gennum plans to launch a new product family in conjunction with the event and will be demonstrating the working silicon of these new digital parts, live for the first time. Gennum's new product family will offer telecom and datacom customers the highest level of integration, functionality, and performance available in the market today.

Gennum will be demonstrating the performance results of several recently announced products, including the GN7350, the world's first single-chip 10G EPON transceiver, live at the show. The GN7350 offers next generation PON (passive optical network) system manufacturers a solution that reduces power and cost in next generation designs, while enhancing ONU (optical network unit) performance. Combining functionality from Gennum's industry-leading CDR (clock and data recovery) and laser driver technologies the GN7350 enables PON system manufactures to quickly build prototype systems for in-house and field testing.

"We are very excited to announce Gennum's newest optical IC products. These products will enable network OEMs to improve their overall design while leveraging faster time-to-market, lower overall cost, and performance enhancements as a result of Gennum's truly innovative approach to integrated solutions," said Dr. Franz Fink, President and Chief Executive Officer, Gennum Corporation.

Visit Gennum at booth No. 203 in the Corporate Village at the Optical Fiber Communication Conference & Exhibition. Demonstrations are accessible by appointment only and can be arranged by contacting

About Gennum Corporation

Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores for the world's most advanced consumer connectivity, enterprise, video broadcast and data communications products. Leveraging the company's proven optical, analog and mixed-signal products and IP, Gennum enables multimedia and data communications products to send and receive information without compromising the signal integrity. Recognized as an award winner for advances in high definition (HD) broadcasting, Gennum is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, Taiwan, India and the United Kingdom.


For further information: For further information: Keri Fraser, Director of Corporate Communications, Gennum Corporation, Tel: (613) 697-6788, Email:

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