Radient Technologies Inc. Announces Private Placement Offering And Shares for Debt Transaction

/NOT FOR DISTRIBUTION TO THE U.S. NEWSWIRE OR FOR DISSEMINATION IN THE UNITED STATES/

EDMONTON, Nov. 13, 2015 /CNW/ - Radient Technologies Inc. ("Radient" or the "Corporation") (TSX Venture: RTI) announces a non-brokered private placement of up to 7,500,000 units (the "Units") of the Corporation at a price of $0.10 per Unit for aggregate proceeds of up to $750,000 (the "Offering"), subject to regulatory approval. Each Unit shall be comprised of one common share of the Corporation (a "Common Share") and one half Common Share purchase warrant (each whole warrant, a "Unit Warrant"), with each whole Unit Warrant entitling the holder to subscribe for one additional Common Share at a price of $0.25 per Common Share until the date that is 42 months from the date of issuance.  It is anticipated that the Offering will be closed in multiple tranches.

The Corporation may pay a finder's fee comprised of a cash commission of up to 10% of the gross proceeds of the Offering and finder warrants (the "Finder Warrants") of up to 10% of the number of Units sold pursuant to the Offering, subject to the policies of the TSX Venture Exchange. Each Finder Warrant shall be exercisable for one Common Share at a price of $0.10 per Common Share until the date that is up to 24 months from closing of the Offering. The proceeds of the Offering will be used for product development, capital expenditures and general working capital purposes.

In addition, Radient announces that it has entered into a shares for debt agreement with a certain arm's length creditor of the Corporation with respect to the settlement of $34,050 (the "Indebtedness") owing to such creditor by the Corporation whereby, as payment in full of the Indebtedness, the Corporation has agreed to issue to such creditor 340,500 units, with each such unit consisting of one Common Share and one half Common Share purchase warrant (the "Debt Warrant"), with each whole Debt Warrant entitling the holder to subscribe for one additional Common Share at a price of $0.50 per Common Share until the date that is 42 months from the date of issuance (the "Debt Transaction").

The Offering and the Debt Transaction is subject to the receipt of all necessary approvals, including the approval of the TSX Venture Exchange. All securities issued in connection with the Offering and the Debt Transaction will be subject to a statutory four-month hold period.

About Radient
Radient extracts natural compounds from a range of biological materials using microwave assisted processing ("MAP™"), a patented technology platform which provides superior customer outcomes in terms of ingredient purity, yield, and cost. From its 20,000 square foot manufacturing plant in Edmonton, Alberta, Radient serves market leaders in industries that include pharmaceutical, food, beverage, natural health, personal care and biofuel markets. Visit www.radientinc.com for more information.

Information set forth in this news release contains forward-looking information and statements that are based on assumptions as of the date of this news release. These statements reflect management's current estimates, beliefs, intentions and expectations. They are not guarantees of future performance. The terms and phrases "goal", "commitment", "guidance", "expects", "would", "will", "continuing", "drive", "believes", "indicate", "look forward", "grow", "outlook", "forecasts", "intend", and similar terms and phrases are intended to identify these forward-looking statements, including but not limited to statements regarding the completion of the Offering or the Debt Transaction,payment of a finder's fee with respect to the Offering and the use of proceeds of the Offering. The Corporation cautions that all forward looking information and statements are inherently uncertain and that actual performance may be affected by a number of material factors, many of which are beyond the Corporation's control. Such factors include, among other things: risks and uncertainties relating to the Corporation's ability to complete the proposed Offering or the Debt Transaction, the receipt of the necessary approvals to complete the Offering of the Debt Transaction, including receipt of the approval of the TSX Venture Exchange, and the future use of the proceeds by the Corporation. Accordingly, actual and future events, conditions and results may differ materially from the estimates, beliefs, intentions and expectations expressed or implied in the forward looking information. Except as required under applicable securities legislation, the Corporation undertakes no obligation to publicly update or revise forward-looking information.

This news release shall not constitute an offer to sell or the solicitation of any offer to buy, nor shall there be any sale of these securities in any jurisdiction in which such offer, solicitation or sale would be unlawful. The shares offered will not be and have not been registered under the United States Securities Act of 1933, as amended (the "U.S. Securities Act") and may not be offered or sold in the United States absent registration or an applicable exemption from the registration requirements of the U.S. Securities Act and applicable state securities laws.

Neither TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

SOURCE Radient Technologies Inc.

For further information: Contacts: Denis Taschuk, Chief Executive Officer, dtaschuk@radientinc.com, (780) 465-1318; Mike Cabigon, Chief Operating Officer, mcabigon@radientinc.com, (780) 465-1318

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Radient Technologies Inc.

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