Zarlink Simplifies Design of Medical Telemetry Systems Linking Implanted Devices and Monitoring Equipment

    - Development kit demonstrates high data rate, ultra low-power and
      reliable communication link supported by the ZL(TM)70101 transceiver

    OTTAWA, Sept. 18 /CNW Telbec/ - Zarlink Semiconductor Inc. (NYSE/TSX:ZL)
today introduced a development kit that enables faster design and evaluation
of wireless telemetry systems linking implanted medical devices with
monitoring and programming equipment.
    Medical device manufacturers are developing telemetry systems that will
support new monitoring, diagnostic and therapeutic applications to improve
patient care and lower healthcare costs. Zarlink's ZL70101 radio frequency
(RF) transceiver chip is being designed into a range of implanted medical
devices, including pacemakers, implantable cardioverter defibrillators (ICDs),
neurostimulators, drug pumps and physiological monitors, and associated
external monitoring and programming equipment.
    The ZLE70101 Application Development Kit (ADK) demonstrates the high data
rate, ultra low-power and reliable communication link supported by the ZL70101
transceiver. The highly integrated RF chip delivers data rates up to 800 kbps
and operates in the Medical Implant Communication Service (MICS) 402-405 MHz
band. The chip typically consumes 5 milliamps (mA) of supply current in full
operation, while incorporating a unique "wake-up" receiver that allows the
device to operate in an extremely low current 250 nanoamp (nA) "sleep" mode.
    The ZL70101 chip includes a fully featured media access controller (MAC),
designed specifically for MICS applications, that provides forward error
correction, cyclic redundancy check and retransmission to achieve an extremely
reliable data link.
    "Wirelessly enabled medical devices must meet strict performance and
power demands to support new applications without impacting implanted device
battery life," said Steve Swift, senior vice president and general manager of
Zarlink's Medical Communications product group. "The ZLE70101 ADK offers
customers a complete hardware and firmware evaluation platform to support the
fast development of low-power, standards-compliant medical communication
systems built on field-proven MICS technology."

    Complete hardware and firmware kit

    The ZLE70101 ADK includes all hardware and firmware required to permit
customers to test the performance of the in-air communication link between
implanted devices and external equipment. A commonly used application
microcontroller is used for both the implant and base station platforms to
enable rapid integration into a customer's specific system design. An
easy-to-use graphical user interface (GUI) running on a Windows-based PC
controls and demonstrates the capabilities of a ZL70101-enabled medical
telemetry system. The GUI interfaces to the MICS RF boards via a USB2.0
    The kit includes an Applications Development Platform (ADP100) board that
interfaces with the PC through a USB2.0 interface to either the implant or
base station mezzanine boards. The Application Implant Mezzanine (AIM100)
board performs all MICS related implant communications. This board includes
the ZL70101 transceiver, discrete circuits including matching networks for
normal data transmission and wake-up operation, an application microcontroller
connected to the ZL70101 over an industry-standard SPI bus, and an SMA
connector interface to a PCB-based loop antenna. The board operates on an
included battery to simulate normal implant operation.
    The Base Station Mezzanine (BSM100) board performs all MICS-related base
station/monitoring equipment communications processing. The board includes the
same features as the AIM100, with the addition of a wake-up transmitter
subsystem and a received signal strength indicator (RSSI) filter for
performing clear channel assessment (CCA). The BSM100 also includes a
dual-band antenna optimized for performance in the MICS band and supporting
wake-up signaling.
    Also included is a MICS Test Adaptor (MT100) board that enables the
probing of key digital and analog signals for the ZL70101 chip on either the
implant or base station board. A Programmable Cable Adaptor (PCA100) board and
cable enables programming and debugging support for the included applications
    The ZLE70101 ADK is supported by extensive documentation, including a
ZLE70101 ADK user guide, source code overview and board-level documents with
schematics, layout, Gerber files and bill-of-material. To save valuable time
in the development process, the ADP100, AIM100 and BSM100 are fully supported
by embedded firmware with thoroughly commented source code to help developers
quickly understand the programming requirements of the ZL70101 chip while
allowing for firmware reuse.


    For a complete description of the ZLE70101 ADK, including block diagrams
and photos, please visit and download the
ZLE70101 ADK Product Preview.
    The ZLE70101 ADK (product order number ZLE70101 BADA) is now available
for qualified customers. To learn how to become a qualified customer, please
contact Zarlink Semiconductor's Medical Communications sales team at For more information on
Zarlink's ZL70101 MICS transceiver chip, please visit:

    About Zarlink Semiconductor

    For over 30 years, Zarlink Semiconductor has delivered semiconductor
solutions that drive the capabilities of voice, enterprise, broadband and
wireless communications. The Company's success is built on its technology
strengths including voice and data networks, optoelectronics and ultra
low-power communications. For more information, visit
    Shareholders and other individuals wishing to receive, free of charge,
copies of the reports filed with the U.S. Securities and Exchange Commission
and Regulatory Authorities, should visit the Company's web site at or contact Investor Relations.

    Certain statements in this press release constitute forward-looking
statements within the meaning of the Private Securities Litigation Reform Act
of 1995. Such forward-looking statements involve known and unknown risks,
uncertainties, and other factors which may cause the actual results,
performance or achievements of the Company to be materially different from any
future results, performance, or achievements expressed or implied by such
forward-looking statements. Such risks, uncertainties and assumptions include,
among others, the following: our dependence on the successful development and
market introduction of new products; our ability to successfully integrate
businesses acquired in the future; our ability to operate profitably and
generate positive cash flows in the future; our dependence on our foundry
suppliers and third-party subcontractors; order cancellations and deferrals by
our customers; and other factors referenced in our Annual Report on Form 20-F.
Investors are encouraged to consider the risks detailed in this filing.

    Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink
    Semiconductor Inc.

For further information:

For further information: Ed Goffin, Media Relations, (613) 270-7112,; Mike McGinn, Investor Relations, (613) 270-7210,

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