Tundra's SLE Division Announces Market's First 150 Gb/s Interlaken IP Core

    Silicon Logic Engineering Launches High Performance Interlaken
    Interconnect Protocol Core

    EAU CLAIRE, WI, Feb. 27 /CNW Telbec/ - Silicon Logic Engineering Inc.
(SLE), a high-end semiconductor design services division of Tundra
Semiconductor Corporation, today announced the availability of a new 150Gb/s
high speed Interlaken protocol IP core for use in ASIC designs.
    SLE's new Interlaken IP Core is now available with more than twice the
performance of the standard 60Gb/s version. This new high-speed core delivers
the performance and bandwidth that new designs require, now with higher data
transfer rates. The higher performance Interlaken Core is fully scalable,
ideally suited for multiple generations of future network switches, routers
and storage equipment. The scalability is achieved through the combination of
the SERDES speed (3.125Gbps to 6.375Gbps) and a variable number of SERDES
lanes (1 to 24).
    SLE is currently shipping the new 150Gb/s core, and customers report that
the IP delivers the highest data transfer rates available on the market today.
"SLE continues to bring innovative, industry-first technology to market" said
Jeff West, Vice President of Design Services, SLE - a division of Tundra
Semiconductor. "Tundra's customers have come to rely on the quality and
reliability of SLE's custom design services and IP core development."
    Designed and tested to be easily synthesizable into any ASIC technology,
SLE's Interlaken IP Core was built to work with off-the-shelf SERDES from most
leading technology vendors. Using the vendor specific proven SERDES allows SLE
customers to quickly integrate the Interlaken IP Core into the customer's
technology of choice.
    "Tundra is committed to delivering outstanding design services and
quality IP to customers. SLE continues to demonstrate our commitment to
world-class design and development and Tier 1 customer response to this
enhanced Interlaken core demonstrates strong market acceptance of this
first-to-market IP offering," said Daniel Hoste, President and Chief Executive
Officer, Tundra Semiconductor.

    Product Availability

    The SLE licensable 150 Gigabit Interlaken IP is available through SLE's
sales network. For sales related questions, contact sales at
sales@siliconlogic.com or call SLE at 1-908-580-1870.

    About Silicon Logic Engineering

    Silicon Logic Engineering, Inc. (SLE) specializes in right-first-time
design services that address all aspects of ASIC, FPGA and semiconductor
system design services. SLE's proven and repeatable Think Physical(TM) design
process, tools and semiconductor intellectual property reduce time-to-market
and are provided by one of the most experienced VLSI design services teams in
the industry. SLE is a division of Tundra Semiconductor Corporation (TSX:TUN).
For more information about SLE, please visit http://www.siliconlogic.com.

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), Power Architecture(TM), VME, HyperTransport(TM),
Interlaken, and SPI4.2. Tundra's products deliver high functional quality and
simplified board design and layout, with specific focus on system level signal
integrity. Tundra's smart System Interconnect products connect critical
components in high performance embedded systems around the world. For more
information, please visit www.tundra.com.

    SLE, the SLE logo and Think Physical are trademarks of Silicon Logic
Engineering, Inc.
    TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation in Canada, European Union, People's Republic
of China and the United States. Design.Connect.Go. is a trademark of Tundra
Semiconductor Corporation. Other registered and unregistered trademarks are
the property of their respective owners.

    (C) Copyright 2008 Silicon Logic Engineering, Inc.  All rights reserved.
    Information subject to change without notice.


    ASIC: Application Specific Integrated Circuit

    High-End ASICs:  90nm or smaller technology, 30 million or more logic
    gates, with or without challenging power requirements.

    FPGA: Field Programmable Gate Array

    I/O Pins: Input and Output Pins

    IP: Intellectual Property. This news release refers to licensable ASIC or
    FPGA blocks of intellectual property.

    Interlaken: An ultra-scalable chip-to-chip interface protocol written as
    an open specification by Cortina Systems and Cisco Systems, developed as
    licensable ASIC and FPGA IP by SLE.

    SERDES: A SERDES (serializer/deserializer) transceiver converts parallel
    data to and from serial data, thereby reducing the number of signals
    needed in a chip to chip interface.

    SPI4.2: The System Packet Interface Level 4 Phase 2 is a high-speed
    interconnection for 10Gbps aggregate bandwidth applications. The SPI4.2
    standard was written by the Optical Internetworking Forum
    http://www.oiforum.com. The SPI4.2 is also abbreviated as SPI-4.2, SPI-4
    Phase 2 and SPI Level 4 Phase 2.

    VLSI: Very Large Scale Integration

    XAUI: A chip-to-chip interconnect using four lanes of 3.125Gbps serial
    data. XAUI is defined by IEEE802.3ae and used in 10 Gigabit Ethernet
    (10GbE) systems.

For further information:

For further information: Media Inquiries: Keri Zeran, Director Marketing
Communications, Tundra Semiconductor, (613) 697-6788, Keri.Zeran@tundra.com

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