Tundra Semiconductor Broadens PCI Express Portfolio with Tsi381

    Tundra Delivers Superior PCIe Bridge Performance over the Competition

    OTTAWA, Sept. 17 /CNW Telbec/ - Tundra Semiconductor Corporation
(TSX:TUN), a leader in System Interconnect, today launched the Tundra
Tsi381(TM) single lane PCI Express(R) (PCIe) to PCI Bridge. Pin compatible
with competing PCIe bridge products, this new product offers Tundra customers
a superior solution with lower latency and better throughput than competitive
    The Tsi381 is ideal for applications that need to bridge from PCIe to PCI
devices. Its flexibility, high performance, small footprint, and low power
consumption make the Tsi381 ideal for numerous consumer and enterprise
applications such as: line cards, network interface cards, motherboards, PC
adapter cards and option cards, multi-function printers, media centers and
digital video recorders.
    Tundra entered the PCIe market in May, 2007 with the launch of the
Tsi384(TM), a four-lane PCI Express to PCI-X Bridge. "Tundra's PCI product
portfolio is further broadened today, with the launch of the Tsi381 PCI
Express Bridge. Customers can now take advantage of another superior quality
Tundra product that delivers product design excellence and reliable supply to
enable their products to get to market ahead of the competition," said Benny
Chang, Tundra's Chief Technology Officer. "The Tsi381 was designed by our
Hyderabad, India and North American engineering teams to compete with and beat
PCIe bridges currently in the market, on performance, latency and throughput.
Customers that take advantage of this new product offering, receive Tundra's
world-class customer service and support," continued Chang.

    Product Features

    Compliant to the latest PCI Express Base 1.1 specification, the
Tsi381's x1 PCIe Interface enables the bridge to offer exceptional throughput
of up to 2.5 Gbps. The device's PCI Interface can operate up to 66 MHz and
offers designers extensive flexibility by supporting three types of addressing
modes: transparent, opaque, and non-transparent. Transparent mode operation is
available for efficient, flow through configurations, while non-transparent
bridging allows isolation between the Tsi381's PCIe and PCI domains.
Non-transparent bridging also enables multi-host systems and is used in
applications such as intelligent adapter cards. Opaque mode provides
semi-transparent operation for multi-processor configurations and enhanced
private device support. The Tsi381 through its efficient architecture and deep
buffering offers low latency and superior system performance. Its rich feature
set provides designers with the ability to maximize performance for a wide
range of PCI Express bridging applications.

    Pricing, Availability and Design Support Tools

    The Tundra Tsi381 is sampling now and will be in volume production early
Q1 2008. The Tsi381 is designed to operate at industrial temperature range  
(-40 degrees to +85 degrees). Currently sampling in a RoHS compliant,
13x13mm BGA package it will be available in both standard and RoHS compliant
packaging at full production. The Tundra Tsi381 is available through Tundra's
worldwide sales network and at www.tundra.com/buynow. Volume pricing starts at
$7.50 USD for 10K units. For documentation, including; ordering information,
feature sheet, user manual, and hardware manual to assist in accelerated
development with the Tsi381, visit www.tundra.com/Tsi381.


    Tsi381 Product Photos -
    Tundra Semiconductor Products -
    Tundra Semiconductor Webcasts -

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products, intellectual property (IP) and design services backed by world-class
customer service and technical support. Tundra's track record of product
leadership includes over a decade of bridges and switches enabling key
industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), PowerPC(R), VME,
HyperTransport(TM), Interlaken, and SPI4.2. Tundra's products deliver high
functional quality and simplified board design and layout, with specific focus
on system level signal integrity. Tundra's design services division, Silicon
Logic Engineering, Inc., offers industry-leading ASIC and FPGA design
services, semiconductor intellectual property and product development
consulting. Tundra's smart technology connects critical components in high
performance embedded systems around the world. For more information, please
visit www.tundra.com.
    TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation in Canada, the United States, the European
Union and the People's Republic of China. Tsi381, Tsi384 and
Design.Connect.Go. are trademarks of Tundra Semiconductor Corporation. Other
registered and unregistered trademarks are the property of their respective

    (C) Copyright 2007 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.

For further information:

For further information: Keri Zeran, Director Marketing Communications,
(613) 592-0859 ext. 1744, Mobile: (613) 697-6788, keri.zeran@tundra.com

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