Tundra Semiconductor Announces Technology Collaboration and License Agreement

    Tundra's Smart System Interconnect will be Based on IBM's Power(TM)

    OTTAWA, Nov. 29 /CNW Telbec/ - Tundra Semiconductor Corporation
(TSX:TUN), a leader in System Interconnect, today announced the extension of a
technology collaboration and signing of a license agreement with IBM to bring
new Power Architecture(TM) solutions to market as part of Tundra's smart
System Interconnect strategy.
    In August, Tundra announced that it had entered into a product
acquisition agreement to bring to market the first product in its smart System
Interconnect strategy. This product, defined by Tundra, will include a Power
processor core in 90nm technology and is currently being designed by IBM
Global Engineering Solutions to speed the product's time to market. Today,
Tundra and IBM moved a step further and signed a license agreement for a 65nm
Power processor core. The new core will be the processing engine of the future
smart System Interconnect products designed by the Tundra research and
development team.
    "Clients have relied on Tundra's line of high performance host bridge
products for systems using Power CPUs. With our new partnership Tundra and IBM
will have the opportunity to collaborate on solutions across several markets."
said Steve Longoria, Vice President, Semiconductor Solutions, IBM Systems and
Technology Group.
    "The Power Architecture is a dominant architecture in the embedded market
and IBM is a technology leader in the semiconductor industry. Tundra could not
have found a better partner than IBM to deliver leading-edge smart System
Interconnect solutions to the large embedded computing market," said
Daniel Hoste, President and Chief Executive Officer, Tundra Semiconductor.
    The partnership with IBM and the development of new products in 90nm and
65nm Power Architecture technology will empower Tundra to deliver more
products to the market in a shorter timeframe. The combination of IBM
leadership core architectures with the I/O management experience in Tundra's
new smart System Interconnect solutions will allow the Company to
competitively address newer and larger markets, enabling faster growth for the

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products, intellectual property (IP) and design services backed by world-class
customer service and technical support. Tundra's track record of product
leadership includes over a decade of bridges and switches enabling key
industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), PowerPC(R), VME,
HyperTransport(TM), Interlaken, and SPI4.2. Tundra's products deliver high
functional quality and simplified board design and layout, with specific focus
on system level signal integrity. Tundra's design services division, Silicon
Logic Engineering, Inc., offers industry-leading ASIC and FPGA design
services, semiconductor intellectual property and product development
consulting. Tundra's smart technology connects critical components in high
performance embedded systems around the world. For more information, please
visit www.tundra.com.

    Forward Looking Information

    Tundra cautions that forward-looking information in this release is based
on certain assumptions and expectations made by Tundra that may prove to be
inaccurate. Assumptions made include the ability of Tundra to successfully
integrate and exploit this new product, Tundra's ability to develop future
products in this new product line in a timely manner to address market
opportunities, customer demand for Tundra's products and services including
this new product line, Tundra's ability to maintain and enhance existing
customer relationships.
    Furthermore, Tundra cautions that forward-looking statements in this
release are based on current assumptions and expectations that are subject to
risks and uncertainties. Actual results may differ due to factors such as
customer demand for the new product and other products within the new product
line, market risks and trading prices, customer relationships, new product
development, new services offerings, product shipping schedules, competitive
products and services, pricing pressure, and changes in the embedded systems
market specifically. The Company assumes no obligation to update or revise any
forward-looking statements. Additional information identifying risks and
uncertainties is contained in the Company's filings with the various
provincial securities commissions which are available online at www.sedar.com.

    TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor
Corporation in Canada, the United States, the European Union and the People's
Republic of China. Design.Connect.Go. is a trademark of Tundra Semiconductor
Corporation. Other registered and unregistered trademarks are the property of
their respective owners. The Power Architecture and Power.org word marks and
the Power and Power.org logos and related marks are trademarks and service
marks licensed by Power.org.

    (C) Copyright 2007 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.

For further information:

For further information: Keri Zeran, Director, Marketing Communications,
(613) 697-6788, keri.zeran@tundra.com

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