Tundra Semiconductor Announces Interoperability of Tundra's Scalable Serial RapidIO(R) Switch with Texas Instruments New High Performance DSP

    Serial RapidIO Switch and DSP Combination, Now Enables High Performance
    Broadband Systems

    DALLAS, TX and OTTAWA, ON, March 7 /CNW Telbec/ - Tundra Semiconductor
Corporation (TSX:TUN), the leader in System Interconnect, today announced the
interoperability of Tundra's Tsi578(TM) Serial RapidIO(R) Switch with Texas
Instruments recently announced TMS320TCI6487 and TMS320TCI6488 wireless
infrastructure optimized DSPs.
    Using the Tundra Tsi578 Serial RapidIO development platform, Tundra and
Texas Instruments recently completed interoperability testing. The successful
tests prove that Tundra's third generation Serial RapidIO switch, with
multi-cast capability, and Texas Instrument's 3-core, 3GHz DSPs can be
deployed to develop DSP clusters, aggregated with Serial RapidIO switching.
This combination is ideally suited for high data intensive applications such
as WiMAX, 3G, LTE, TD-SCDMA and WiBRO. These types of applications require
multiple DSPs on a single channel card and the Tsi578 switch is uniquely
suited to interconnect the high bandwidth-capable DSPs. Delivering this
combined solution will enable base station manufacturers to achieve optimal
performance of their platform while spanning a wide range of air interfaces.
    "Some of our wireless infrastructure customers have begun designing this
high performance combination of industry-leading products, thereby enabling
their next-generation RapidIO-based systems to meet the OFDM processing and
Turbo Decode requirements," said Daniel Hoste, President and Chief Executive
Officer at Tundra. "The Tundra/TI solution offers the power and
configurability that designers of embedded solutions need to build reliable,
high performance RapidIO-based systems for a wide range of scalable and high
bandwidth applications".
    "The TCI6487 and TCI6488 DSPs deliver maximum performance with a
significantly reduced bill of materials," said Travis Scheckel, TI's RapidIO
Development Manager and Chair of the RapidIO Technical Working Group.
"Interoperability testing such as this effort gives base station manufacturers
a measure of confidence that their solution will meet the carriers' needs in a
timely fashion, while delivering higher performance, greater scalability and
low power."
    Texas Instruments announced availability of the TCI6487 in December 2006,
the newest 3GHz-performing wireless infrastructure baseband product that
boosts applications for GSM-based base stations while addressing new markets
and requirements for WiMAX and TD-SCDMA. TI also announced the availability of
TCI6488 in February 2007 for the WCDMA market, integrating a Receiver
Accelerator Co-Processor. Both products support three cores running at 1GHz
each. The TCI6487 and TCI6488 processors enable base station manufacturers to
extend their existing designs while entering into new markets, requiring small
form factor applications with an exceptional scaleable, flexible solution.
    In February 2006, Tundra launched the Tsi578 Serial RapidIO Switch with
multicast capability, responding to designers' requirement for low
interconnect processing overhead, lowest power consumption, minimum latency as
well as board layout with high signal integrity. The Tsi578 supports the
1.3 RapidIO specification, and its broad feature set includes; field proven
port flexibility which supports mixed port widths at up to 10 Gbps data
speeds, hardware multicast, supervised traffic flow for increased performance
and fabric management, and enhanced SerDes for the lowest power switch
solution available in the market today.

    About Tundra RapidIO(R) Switches

    Tundra switches provide chip-to-chip interconnect between RapidIO
end-points and can replace existing proprietary backplane fabrics for
board-to-board interconnect. As a founding member of the RapidIO Trade
Association and long-time Steering Committee member, Tundra continues to
provide leadership in the development of the RapidIO standard and was the
first semiconductor vendor to bring Parallel and Serial RapidIO switches to
market. RapidIO is the leading serial interconnect standard for embedded
systems and is supported by industry leaders such as, Alcatel- Lucent
Technologies, AMCC, EMC Corporation, Ericsson, and Freescale Semiconductor .
The Tundra family of RapidIO switches includes the Tsi578(TM), Tsi576(TM),
Tsi574(TM), Tsi568A(TM), and Tsi564A(TM).

    About Texas Instruments DSP Baseband Solution

    TI's TCI6487 offers three-times the performance of previous
infrastructure solutions, providing greater channel enhancement and more
flexibility while reducing design complexity for OEMs. Manufactured in 65nm
process node, this new DSP is the highest performing processor in TI's
TMS320C64x(TM) DSP family. As a result, carriers will be able to deploy
advanced networks quickly while future proofing their investments. The ability
to upgrade performance with software enhancements also enables service
providers to support emerging standards such as LTE, 3GPP and 3GPP+, while
easily adding new features and services to their networks. This, in turn, will
provide subscribers access to the latest and greatest services and
capabilities that the wireless world can deliver.

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), PowerPC(R), VME, HyperTransport(TM), Interlaken,
and SPI4.2. Tundra's products deliver high functional quality and simplified
board design and layout, with specific focus on system level signal integrity.
Tundra's design services division, Silicon Logic Engineering, Inc., offers
industry-leading ASIC and FPGA design services, semiconductor intellectual
property and product development consulting. Tundra's smart technology
connects critical components in high performance embedded systems around the
world. For more information, please visit www.tundra.com.

    About Texas Instruments

    Texas Instruments Incorporated provides innovative DSP and Analog
technologies to meet our customers' real world signal processing requirements.
In addition to Semiconductor, the company includes the Education Technology
business. TI is headquartered in Dallas, Texas, and has manufacturing, design
or sales operations in more than 25 countries. Texas Instruments is traded on
the New York Stock Exchange under the symbol TXN. More information is located
on the World Wide Web at www.ti.com.

    Tsi578 Product Photo -
    Tsi578 Block Diagram -
    Tundra Semiconductor Products - http://www.tundra.com/products.aspx
    Tundra Semiconductor Webcasts -
    Tundra Semiconductor Technical Briefs -

    TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation (Canada - registration in the United States,
European Union, and People's Republic of China pending). Tsi578, Tsi576,
Tsi574, Tsi568A, Tsi564A and Design.Connect.Go. are trademarks of Tundra
Semiconductor Corporation. RapidIO is a registered trademark of the RapidIO
Trade Association. Other registered and unregistered trademarks are the
property of their respective owners.

    Development of the Tsi578, Tsi576 and Tsi574 were made possible in part
with the assistance of the Technology Partnerships Canada Program.

    (C) Copyright 2007 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.

For further information:

For further information: North America: Keri Zeran, + 1(613) 697-6788,
keri.zeran@tundra.com; Europe: Rob Davies, + 44 (0)1225 470000,
rob.davies@publitek.com; China: Jo Soo, + 852.2837.4727, jo.soo@edelman.com

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