RapidIO Enables 10 Gbps Bandwidth across the Backplane and Chip-to-Chip
DALLAS, TX, Feb. 25 /CNW Telbec/ - Texas Instruments Developers
Conference 2008 - Tundra Semiconductor Corporation (TSX:TUN), a leader in
System Interconnect, today announced the availability of the market's first
end-to-end RapidIO(R)-enabled MicroTCA(TM) platform for wireless baseband. The
platform, offers end-to-end 10 Gigabit RapidIO Interconnect for chip-to-chip
and board-to-board links across the backplane.
The platform will allow wireless telecommunication system vendors to
expedite their go-to-market schedule with this "baseband-in-a-box" solution.
Production-ready components, available now, will speed wireless infrastructure
design cycles and free up resources to focus on application firmware and
software development. Leveraging the industry's leading semiconductor
components, vendors can go to market in full volume production ahead of their
"The baseband platform is a unique solution designed to specifically
address wireless base station vendor requirements," said Kathy Brown, product
manager for communications infrastructure, digital signal processor systems
(DSP), Texas Instruments (TI). "Base station manufacturers rely on TI's high
performance DSPs to accommodate bandwidth intense applications, and this new
platform allows our customers to focus on custom base station development with
a production-ready, interoperable hardware system in place."
"This industry-leading combination of high performance products will
change the way our customers develop wireless baseband stations. This
'baseband-in-a-box' solution is a revolutionary way for customers to take
advantage of the best the market has to offer, in an off-the-shelf solution
leveraging the MicroTCA and RapidIO standards," said Daniel Hoste, President
and Chief Executive Officer, Tundra Semiconductor. "This platform offers the
processing power and configurability that designers of embedded solutions need
to build reliable, high performance RapidIO-based systems for a wide range of
scalable and high bandwidth applications".
Four leading vendors supply the components of this industry-first RapidIO
- Mercury Ensemble MSW-100 RapidIO MicroTCA Switch Module, including
- CommAgility AMC-6487C Baseband Advanced Mezzanine Card, which
includes Texas Instruments TCI6487 Multicore DSPs and Tundra's Tsi578
Serial RapidIO Switch
- Tundra Tsi574(TM) Serial RapidIO Signal Analyzer
- Fabric Embedded Tools RapidFET(TM) Probe
The AMC Baseband Card provides multicore DSP performance to address the
processing needs of LTE, WiMAX and eWCDMA, leveraging RapidIO. The combined
Mercury Ensemble MSW-100 MicroTCA Switch Module and Tsi574 Signal Analyzer
solution deliver optimum 10 Gigabit RapidIO backplane design. System
configuration and bring up is enabled by RapidFET Probe portable diagnostic
tool. Individual components in this combined solution can be purchased now,
from the respective component vendors. TI's recently announced TCI6484 EVM can
be added to the baseband platform, for those customers choosing to use high
performance single core DSPs for wireless applications.
"RapidIO is the interconnect of choice for next generation wireless
infrastructure systems, with up to 10 Gbps data transfer rates across the
backplane and chip-to-chip. Now, designers can jumpstart their base station
design with an off-the-shelf solution, using proven interoperable components
from leading RapidIO providers," said Tom Cox, Executive Director, RapidIO
Tundra is displaying its "baseband-in-a-box solution" at the TI Developer
Conference in Dallas Texas this week. For details go to www.tundra.com, or
stop by their booth, #121. The new platform will be featured in the following
presentation at TI Developer Conference, "Cost Reducing Wireless Baseband with
Tundra RapidIO Switches and TI DSPs," Tuesday Feb 26th 2:00 p.m.
About Tundra RapidIO(R) Switches
Tundra switches provide chip-to-chip interconnect between RapidIO
end-points and can replace existing proprietary backplane fabrics for
board-to-board interconnect. As a founding member of the RapidIO Trade
Association and long-time Steering Committee member, Tundra continues to
provide leadership in the development of the RapidIO standard and was the
first semiconductor vendor to bring Parallel and Serial RapidIO switches to
market. RapidIO is the leading serial interconnect standard for embedded
systems and is supported by industry leaders such as, Alcatel- Lucent
Technologies, AMCC, EMC Corporation, Ericsson, and Freescale Semiconductor.
The Tundra family of RapidIO switches includes the Tsi620(TM), Tsi578(TM),
Tsi576(TM), Tsi574(TM), Tsi568A(TM), and Tsi564A(TM).
About Texas Instruments DSP Baseband Solution
TI's TCI6487 offers three-times the performance of previous
infrastructure solutions, providing greater channel enhancement and more
flexibility while reducing design complexity for OEMs. Manufactured in
65nm process node, this new DSP is the highest performing processor in TI's
TMS320C64x+(TM) DSP series. As a result, carriers will be able to deploy
advanced networks quickly while future proofing their investments. The ability
to upgrade performance with software enhancements also enables service
providers to support emerging standards such as LTE, 3GPP and 3GPP+, while
easily adding new features and services to their networks. This, in turn, will
provide subscribers access to the latest and greatest services and
capabilities that the wireless world can deliver.
Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), Power Architecture(R), VME, HyperTransport(TM),
Interlaken, and SPI4.2. Tundra's products deliver high functional quality and
simplified board design and layout, with specific focus on system level signal
integrity. Tundra's design services division, Silicon Logic Engineering, Inc.,
offers industry-leading ASIC and FPGA design services, semiconductor
intellectual property and product development consulting. Tundra's smart
technology connects critical components in high performance embedded systems
around the world. For more information, please visit www.tundra.com.
About the Texas Instruments Developer Network
Tundra Semiconductor Corporation is a member of the TI Developer Network,
a community of respected, well-established companies offering products and
services based on TI analog and digital technology. The Network provides a
broad range of end-equipment solutions, embedded software, engineering
services and development tools that help customers accelerate innovation to
make the world smarter, healthier, safer, greener and more fun.
Product Ordering Information:
Tundra Semiconductor www.tundra.com
Texas Instruments www.ti.com
Mercury Computer Systems www.mc.com
Fabric Embedded Tools www.fetcorp.com
TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor
Corporation (Canada, the United States, European Union, and People's Republic
of China). Tsi620, Tsi578, Tsi576, Tsi574 and Design.Connect.Go. are
trademarks of Tundra Semiconductor Corporation. RapidIO is a registered
trademark of the RapidIO Trade Association. Other registered and unregistered
trademarks are the property of their respective owners.
Development of the Tsi578, Tsi576 and Tsi574 were made possible in part
with the assistance of the Technology Partnerships Canada Program.
(C) Copyright 2008 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.
For further information:
For further information: Keri Zeran, Director Marketing Communications,
Tundra Semiconductor, (613) 697-6788, firstname.lastname@example.org