TSMC Announces Multi-layer Mask Service

    Available for 90nm, 80nm and 65nm process technologies

    HSINCHU, Taiwan, R.O.C., Dec. 27 /CNW/ -- Taiwan Semiconductor
Manufacturing Company, Inc. (TSE: 2330, NYSE:   TSM) today announced the foundry
industry's first multi-layer mask service (MLM) for 90nm, 80nm and 65nm
advanced process technologies.
    MLM service is another mask service TSMC offers beyond multi-project
wafer prototyping service, CyberShuttle(SM), and normal production tape-out to
enable maximum customer flexibility. MLM is especially appropriate for
prototyping single or multi-chip verifications or small volume production
    The MLM service reduces the number of masks used by placing images with
the same mask grade from several mask layers onto one reticle. Consequently,
customers only pay for the actual number of reticles made plus the data
processing of each mask layer.  A special in-fab IT system automates the
reticle handling and the wafer process flow. The same wafer acceptance
criteria used in normal mask sets are applied so wafers achieve identical
process and quality results.
    "Configuring four mask layers onto a single reticle generates the ideal
cost-to-performance ratio," said Ed Chen, senior director of Strategic and
Service Marketing at TSMC. "The savings in mask costs enables our customers to
enter advanced technologies with lower NRE investment.  We emphasize
flexibility so that companies can launch tape-out at anytime and, subsequently
can carry out full package or board level development if needed," he added. As
of Q4'07, TSMC has successfully completed and delivered over a score of MLM
service runs in 90nm, 80nm and 65nm, across different product segments.
    About TSMC
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry industry's largest
portfolio of process-proven libraries, IP, design tools and reference flows.
The Company's total managed capacity in 2006 exceeded seven million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GigaFabs,
four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 65nm production capabilities.  Its
corporate headquarters are in Hsinchu, Taiwan.  For more information about
TSMC please visit http://www.tsmc.com.

For further information:

For further information: Chuck Byers of TSMC North America, 
+1-408-382-7919, cbyers@tsmc.com; or JH Tzeng of TSMC Public Relation, 
+886-3-505-5028, jhtzeng@tsmc.com Web Site: http://www.tsmc.com

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