Ormecon Introducing Ultrathin New Organic Nanometal Surface Finish in Commercial Scale

    HAMBURG, Germany, Sept. 26 /CNW/ -

    - First Industrial Line Being Installed in Korea

    A completely new nano size surface finish is introduced by Ormecon
International into the Printed Circuit Board market. The thickness is only
55 nanometres, the layer consists of a nanoparticle complex formed between the
Organic Nanometal and Silver (the Silver only contributes up less than 10% to
    Nonetheless, this ultrathin layer provides a much more powerful oxidation
protection and solderability preservation than any other established metallic
finish - although the established finishes are between 6 and 100 times thicker
than this new nanofinish.
    According to Ormecon, several tests in many companies in the electronics
industry have already shown a superior thermal resistance and perfect
    Only three months after the first public presentation by Dr. Bernhard
Wessling, the inventor and Ormecon CEO in July 2007, a first industrial line
for the deposition of the new nanofinish will be installed in Korea at
Ormecon's customer YooJin. The line will go into operation in the second half
of October.
    It will be the first commercial line to provide a nano sized surface
finish for printed circuit boards.
    The energy consumption will only be 10 - 30%, the total environmental
resource consumption is less than 1% compared to conventional surface finish
    More information is available on Ormecon's website

    Background information:

    Printed Circuit Boards (PCB) are the basis for any electronic control in
computers, mobile phones, printers, TVs, and of all electric and electronic
control tasks in cars, airplanes, satellites, elevators, dish washer, washing
machines, refrigerators and even modern coffee machines.
    Chips and other electronic components are being fixed (soldered) on
defined locations on the printed circuit board, and the board contains the
circuit by which the components are connected with each other.
    The manufacturing of the fully functioning PCB is separated in the
industry, first, the PCB manufacturer produces the bare board with the
circuit, then the so-called "assembler" puts the electronic components on the
boards and fixes them firmly by soldering.
    This positioning and soldering process is fully automatic, is running for
several times at peak temperatures or around 260 degrees C and therefore
requires a 100% guarantee that every of the many 100 partially microscopically
small Cu locations will accept the solder and form a connection which is
stable for many years even under temperature changes between low arctic or
even lower space temperature, up to high operating temperatures like 80 or
150 degrees C close to motors or within a laptop, regardless whether under
constant vibrations (like in a car or airplane) or not.
    Therefore, the final surface finish is the most critical step on the PCB
manufacturing, and the new Nanofinish is promising to revolutionize surface
finishing of PCBs.

    Ormecon International is a small internationally operating group
companies, founded by Dr. Bernhard Wessling who discovered and introduced the
new nanomaterial class of Organic Metals.

For further information:

For further information: Dr. Bernhard Wessling, Ormecon GmbH,
wessling@ormecon.de, Phone: +49-40-60410618

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