SEOUL, KOREA & TORONTO, CANADA, August 7 /CNW/ - MK Electron Company,
LTD, a Korean-based company (KOSDAQ:033160), specializing in the manufacturing
and global distribution of core semiconductor materials (gold and copper
bonding wire, solder balls, sputtering targets and evaporate materials) and
Microbonds Inc., an inventor and licensor of insulation for bonding wires and
related processes, today announced that MKE has entered into long term license
and supply agreements with Microbonds, enabling the application of Microbonds
X-Wire(TM) technology to MKE's market leading gold bonding wires.
MKE's X-Wire family of products will be targeted at addressing many of
the significant interconnect challenges in today's complex semiconductor
packaging applications associated with the manufacture of a wide range of
electronic products, particularly leading wireless and handheld devices.
"As a leader in the global market for bonding wire, MKE recognizes the
industry's need for an interconnect solution that extends the current low cost
infrastructure of equipment and process knowledge beyond the capabilities of
bare bonding wires. Increasing interconnect densities driven by smaller more
powerful applications highlight the need to allow interconnects to touch and
cross without electrical shorting," said S.Y. Choi, President and CEO of MKE.
"Our strategic alliance with Microbonds is a strong demonstration of our
commitment to being a leader in offering our customers next-generation
interconnect solutions to meet their requirements, and is a reflection of the
progress and leadership of Microbonds in using X-Wire technology in advanced
packaging," he added.
"Insulated bonding wire is one of the most important recent developments
in wire bonding technology. With the strong growth in wire bonded stacked die
packages and bonding over active areas, and other advances in interconnect
technology, the industry has been waiting for many years for a proven
insulated wire technology that can be used with the existing equipment
infrastructure," said Jan Vardaman, of TechSearch International, Inc., the
industry's leading semiconductor assembly and materials consultancy.
"Continued increases in the price of gold make the ability to use smaller
diameter insulated bonding wires an enabler in the goal of improved
performance with continued cost reductions," Vardaman added.
"The establishment of this important relationship with MKE allows
Microbonds to extend its global capabilities and continues the work we have
undertaken to support X-Wire with proven supply chain partners," said John M.
Scott, President and CEO of Microbonds. "The integration of our technology
with MKE's leading bonding wires offers the industry another reliable source
of insulated bond wire for use in an expanding array of existing and new chip
and package designs, leading to yield improvements, package size reductions,
performances enhancements and cost savings."
The parties expect to launch the commercial availability of MKE
X-Wire(TM) by the end of the third quarter of 2007.
About MK Electron Co. Ltd.
MKE (KOSDAQ:033160), headquartered in Yongin, Korea, has been developing
and manufacturing core semiconductor materials such as Gold Bonding Wire, Cu
Bonding Wire, Sputtering Target, Evaporate materials and Solder Ball, etc
since 1982. MKE is now a global market leader, thanks to the unique
manufacturing know-how and the patented technologies. For more information,
About Microbonds Inc.
Microbonds, Inc. is the leading developer and licensor of insulated wire
bonding technologies for use in the design and assembly of microelectronic
devices. The company's X-Wire Technology enables the development of faster,
smaller and cheaper microchips while improving manufacturing reliability.
Founded in 1999 by IBM-trained engineers, the company's approach is proven
through testing with major IC companies. For more information, see
About TechSearch International Inc.
TechSearch International, Inc., founded in 1987, is market research firm
specializing in technology trends microelectronics packaging and assembly.
Multi- and single-client services encompass technology licensing, strategic
planning, and market and technology analysis. Research topics include flip
chip interconnects and wafer level packaging, CSPs, BGAs, high-density flex
circuits, microvia substrates, and system-in-packages (SiP), and lead-free and
environmentally friendly manufacturing. TechSearch International professionals
have an extensive network of more than 14,000 contacts in North America, Asia,
and Europe. For more information, contact TechSearch at Tel: 512-372-8887,
fax: 512-372-8889, or http://www.techsearchinc.com.
About X-Wire Technology
Microbonds' X-Wire(TM) Technology is an interconnect solution which
consists of a proprietary insulation applied to bare bonding wires. Insulated
bonding wires have been added to the 2006 ITRS Roadmap. (See
Technology enables interconnect bonding wires to touch and cross without
causing an electrical short. With X-Wire(TM), customers can solve yield losses
due to wire sweep, increase I/O counts, design new package types, achieve new
geometries through new bonding rules, as well as reduce costs through direct
to ball bonding and thinner diameter wires
MKE is a trademark of MK Electron Company, LTD. Microbonds, X-Wire,
X-Wire Technology are trademarks of Microbonds, Inc. All other trademarks and
registered trademarks are the property of their respective owners.
For further information:
For further information: Microbonds John Scott, 1-905-305-0980 x222
President & CEO email@example.com OR MKE Jin Lee, +82-31-330-1966
Executive Director of Sales & Marketing firstname.lastname@example.org