Solution for Both New and Legacy Fibre Channel and Ethernet Designs Now in Mass Production
BURLINGTON, ON, Sept. 19, 2011 /CNW/ - Gennum Corporation (TSX:GND), a
global innovator in high-speed optical, analog and mixed-signal
semiconductor solutions, has expanded its portfolio by launching into
mass production the industry's first 16G Fibre Channel module chipset
which is also compatible with existing Fibre Channel applications,
including 4-8G Fibre Channel and 10G Fibre Channel over Ethernet.
The industry's first and only 4-16G multi-rate module IC solution
chipset is comprised of two groundbreaking Gennum products: the GN2017
and the GN1068. The GN2017 transceiver is the industry's first dual CDR
(clock and data recovery) with integrated VCSEL driver and limiting
amplifier, which addresses signal integrity issues at 14Gb/s speeds,
the data rate adopted for 16G Fibre Channel. The GN1068 is a
rate-selectable TIA (transimpedance amplifier) offering leading
parametric performance at 14Gb/s with the lowest-available power
Driven by the increasing bandwidth and capacity requirements imposed on
switching technology by cloud computing, Fibre Channel networks are
being quickly forced into doubling their line rates while improving
their cost and power efficiency.
Gennum's combination of a dual CDR transceiver solution with a low power
TIA further bolsters Fibre Channel networks as the preferred conduit
for linking virtual servers to storage at 14Gb/s line rates, allowing
customers to upgrade the speed of their switching networks while
remaining compatible with existing protocols.
"Gennum has once again proven its leadership by responding to the
industry's complex dual requirements for increased performance at
reduced cost and power by designing a highly integrated chipset with
best-in-class performance," said Gary Beauchamp, Senior Vice President,
Mixed Signal and Optical Products at Gennum. "Gennum's demonstrated
ability to design for high-volume manufacturability allows customers to
continue to rely on us to provide proven, reliable products for
critical connections between virtualized datacenters."
The GN2017 is compliant with the FC-PI-5 standard for fiber optic links
and also supports Fibre Channel over Ethernet and legacy Fibre Channel
rates, so that a single module can be designed to support multiple
standards. It is the first 14Gb/s device in the industry that lowers
the total BOM cost by integrating the limiting amplifier, VCSEL driver
and dual CDRs into a single chip. The chip addresses the strict SFP+
module space and power requirements with a small 5mm x 5mm 32-pin QFN
package, and enables modules with less than 1W power consumption.
The GN1068 features 90mW of power consumption under typical conditions,
making it the lowest power >10Gb/s TIA available on the market. It
features on-chip bandwidth selection allowing for versatility across
multiple Ethernet and FibreChannel applications, ranging from 4-14Gb/s.
Based on existing Gennum TIA's which have received wide market
acceptance with over 44 million devices sold, the GN1068's low input
noise and high gain give excellent sensitivity performance while
excluding crosstalk and power supply noise. The GN1068 continues
Gennum's excellence for use in high-volume manufacturability using a
variety of OSA packages, including TO-cans.
Gennum's new 16G Fibre Channel module chipset joins one of the
industry's most comprehensive portfolios of optical transceiver IC
products ranging from 100Mb/s-100Gb/s. For component suppliers, this
highly differentiated set of products gives a unique roadmap that
improves performance and reliability, simplifies design, lowers costs
and speeds time to market. For systems designers and manufacturers,
Gennum's multi-lane and multi-rate 10Gb/s-100Gb/s backplane solutions
provide cost-effective low power, high performance ways to enable
The GN1068 TIA and GN2017 transceiver chips are in full production, with
the TIA available in bare-die format and the transceiver chip available
in a 5x5mm QFN package. The ordering part numbers are GN1068-CHIP and
About Gennum Corporation
Gennum Corporation (TSX: GND) designs innovative semiconductor solutions
and intellectual property (IP) cores for the world's most advanced
consumer connectivity, enterprise, video broadcast and data
communications products. Leveraging the company's proven optical,
analog and mixed-signal products and IP, Gennum enables multimedia and
data communications products to send and receive information without
compromising the signal integrity. Recognized as an award winner for
advances in high definition (HD) broadcasting, Gennum is headquartered
in Burlington, Canada, and has global design, research and development
and sales offices in Canada, Mexico, Japan, Germany, United States,
Taiwan, India and the United Kingdom. www.gennum.com.
Gennum and the Gennum logo are trademarks of Gennum Corporation.
Copyright Gennum Corporation, 2011.
SOURCE Gennum Corporation