Fujitsu Set to Sample Mobile WiMAX Chipsets for Mobile Devices

    Designed to Fit in the WiMAX Module of 12x12mm, Features Idle Current of
    Less than 0.5mA

    SUNNYVALE, Calif., June 16 /CNW/ -- Fujitsu Microelectronics America,
Inc. (FMA) today announced a new mobile WiMAX chipset optimized for small,
embedded modules targeting mobile WiMAX devices such as smart phones and PDAs.
 Samples will be delivered to major module manufacturers starting in August
    The chipset includes a baseband IC, the MB86K22; an RF IC, the MB86K52;
and a power management IC, the MB39C316.  The three devices are essential
elements for competitive WiMAX modules.  The chipset was designed so that the
size of the WiMAX module will be 12x12mm.  The idle current, which has a
direct impact on battery life, will not exceed 0.5mA, helping the development
of attractive mobile WiMAX terminals.
    The next-generation Mobile WiMAX technology will be deployed in the
United States, Europe, and Taiwan this year, and in Japan next year.  The
initial service will be through PC-based mobile broadband access, with
simultaneous development of handsets, smart phones, PDAs, portable games and
navigation systems.
    With this chipset, module vendors can offer competitive mobile WiMAX
products in a small form factor.  The chipset's mature software stacks have
been proven in the previous generation product, and the power management
schemes have been optimized at the system level.  These factors enable mobile
WiMAX terminal manufacturers to focus on designing attractive user interfaces
and service-oriented applications.
    "This highly integrated WiMAX chipset features the low power and small
form factor essential to the development of attractive mobile WiMAX terminal
products," said Makoto Awaga, general manager of the mobile solution business
group of Fujitsu Microelectronics Limited in Japan.  "Fujitsu has assumed a
global leadership position in moving WiMAX into deployment, and we are now
ready to work with module vendors to meet market requirements."
    Chipset Key Features
    The MB86K22 is a fully integrated baseband IC built using the Fujitsu
65nm advanced CMOS low-leakage process technology.  The operating power of the
MB86K22 has been reduced by 36 percent from the previous generation.
Power-gating technology shuts down the power supply in the unused blocks
inside the device, so that the entire mobile WiMAX module consumes only 0.5mA,
extending battery life.
    The MB86K52 is an RF IC built using CMOS process technology, which
supports 2.3GHz, 2.5GHz, and 3.5GHz, almost all the frequencies set by the
WiMAX Forum(TM).  This offers mobile WiMAX terminal manufacturers the ability
to introduce global WiMAX devices. The MB86K52 also supports MIMO and
beamforming technology, which are essential for mobile WiMAX Wave 2.
    The MB39C316 power management IC eliminates all the complex and
time-consuming power management requirements by accommodating one cell
    This design minimizes the peripheral components outside of the module. 
The MB39C316 controls and manages the module's power schemes at the system
level, achieving the lowest power consumption at each operation.

    MB86K22 Baseband IC

    Bandwidth          3.5MHz, 5MHz, 7MHz, 10MHz, 20MHz (planned)
    Modulation         64QAM / 16QAM / QPSK
    FFT size           512/1024 FFT OFDMA
    Antenna            2x2 STC/MIMO (MatrixA and MatrixB)
    OS                 Windows Mobile / Embedded Linux
    Host interface     SDIO, SPI

    MB86K52 RF IC

    RF frequencies     2.295GHz - 2.405GHz / 2.491GHz - 2.695GHz /
                       3.295GHz - 3.620GHz
    Bandwidth          3.5MHz, 5MHz, 7MHz, 10MHz, 20MHz
    FFT size           512/1024 FFT OFDMA
    Antenna            2x2 STC/MIMO (MatrixA and MatrixB)

    MB39C316 Power Management IC

    Power supply
     voltage           2.7V - 4.9V, 1 cell lithium ion battery
    Output             DC/DC 3 channel, LDO 4 channel
    Sequence control   Power voltage activation/deactivation
    Interface          I2C
    Samples of the Fujitsu Mobile WiMAX chipset will be available in August.
Pricing is available upon request.
    About Fujitsu Microelectronics America, Inc.
    Fujitsu Microelectronics America, Inc. (FMA) leads the industry in
innovation.  Fujitsu provides high-quality, reliable semiconductor products
and services for the networking, communications, automotive, security and
other markets throughout North and South America.  As a founding member and
current board member of the WiMAX Forum(TM), Fujitsu supports the standards
development and compliance programs that are essential to successful Broadband
Wireless deployment.  Fujitsu provides performance-driven WiMAX solutions by
leveraging the company's experience and expertise in the networking and
communications markets.  Fujitsu offers flexible WiMAX SoC and reference
designs for WiMAX-certifiable systems to equipment vendors.  For more product
information, please visit the company's web site at, or address e-mail to

    Reference Material:
    The Fujitsu Mobile WiMAX module fact sheet
    The Fujitsu Mobile WiMAX module block diagram:
    All company and other product names mentioned may be trademarks or
registered trademarks of their respective owners.

For further information:

For further information: Emi Igarashi of Fujitsu Microelectronics
America,  Inc., +1-408-737-5647,; or Dick Davies of 
Independent Public Relations, +1-415-652-7515,, for 
Fujitsu Microelectronics America, Inc. Web Site:

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