Fujitsu Microelectronics and TSMC to Collaborate on 28nm Process Technology


    TOKYO and HSIN-CHU, Taiwan, Aug. 27 /CNW/ -- Fujitsu Microelectronics
Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330,
NYSE:   TSM) today announced that they have agreed to collaborate on
28-nanometer (nm) process technology targeted for foundry production of
Fujitsu Microelectronics' 28nm logic ICs and to jointly develop an enhanced
28nm high-performance process technology by utilizing TSMC's advanced
technology platform. Previously, both companies announced that Fujitsu
Microelectronics will collaborate with TSMC on 40nm production. This will
extend Fujitsu Microelectronics' 40nm collaboration with TSMC and covers joint
development of an optimized 28nm high-performance process technology. Initial
28nm samples are expected to ship toward the end of 2010.

    This collaborative effort combines Fujitsu Microelectronics' expertise
and strength in advanced high-speed process and low-power design technologies
with TSMC's expertise and strength in power-efficient high- performance
logic/SoC process and leading-edge technology platform that is part of the
Open Innovation Platform(TM) from TSMC. Extending the collaboration to 28nm
will provide the opportunity for both companies to capitalize on a competitive
and high-performance 28nm technology based on TSMC's 28nm technology portfolio
that includes high-performance and low-power applications.

    The two companies are also discussing possibilities for collaborating on
advanced packaging that could include joint developments that combine Fujitsu
Microelectronics' strengths in high-performance lead-free and ultra-high-pin
count packaging technologies, with TSMC's strength in chip-package integration
and advanced Cu/ELK interconnect.

    "We are rapidly progressing in our previously-announced collaboration
with TSMC on 40nm process technology, with several product designs in progress
at present," said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu
Microelectronics Limited. "With this further agreement with TSMC on 28nm
high-performance process technology development and production, we combine
both companies' strengths to create greater value for our customers, and will
further drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP
(*1) core products."

    "Fujitsu Microelectronics selected TSMC as a partner based in part on
TSMC's unsurpassed record of developing and ramping advanced technologies. The
agreement today is also a vote of confidence in TSMC's technology platforms
that include design related considerations such as design kits, design flows,
TSMC and 3rd party IP; robust device related documentation, processes
technology excellence and backend assembly and test capabilities," said Jason
Chen, Vice President, Worldwide Sales and Marketing, TSMC.

    *1: ASIC and ASSP
    ASIC: Application specific IC. Customized ICs for specific applications
    ASSP: Application specific standard product. IC products for specific
applications, such as image processing and network-related processing.

    Fujitsu Microelectronics Customer Contact:
    Fujitsu Microelectronics Limited
    Business Management Division
act/for m.html

    About Fujitsu Microelectronics Limited (FML)
    Fujitsu Microelectronics Limited designs and manufactures semiconductors,
providing highly reliable, optimal solutions and support to meet the varying
needs of its customers. Products and services include ASICs/COT, ASSPs, power
management ICs, and flash microcontrollers, with wide-ranging expertise
focusing on imaging, wireless, automotive and security applications. Fujitsu
Microelectronics also drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was established as a
subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and
development network, with sites in Japan and throughout Asia, Europe, and the
Americas, Fujitsu Microelectronics offers semiconductor solutions to the
global marketplace. For more information:

    About TSMC
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IPs, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs
(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please

    All company or product names referenced herein are trademarks or
registered trademarks of their respective owners. Information provided in this
press release is accurate at time of publication and is subject to change
without advance notice.


For further information:

For further information: Fujitsu Limited, Public and Investor Relations
Division,  Inquiries:; or
Michael Kramer, Corporate Public Relations, of Taiwan Semiconductor
Manufacturing Company, Ltd., 886-3-563-6688, ext. 712-6216; or  TSMC Japan
Limited, Press Center, c/o: E&E, Inc., 81-422-30-8800 Web Site:

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