e-Shuttle and Hong Kong Science and Technology Parks Collaborate to Provide Silicon Shuttle Services for Asian Start-ups

    HONG KONG, TOKYO, and SUNNYVALE, Calif., Sept. 26 /CNW/-- Hong Kong
Science and Technology Parks Corporation (HKSTP) and Fujitsu Microelectronics
Limited's (FML) subsidiary e-Shuttle Inc. (ESI) in Japan have signed an
agreement to provide silicon shuttle services for start-up integrated circuit
(IC) design houses in Asia.
    The initiative, boosting Asia's semiconductor industry, provides
first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost.
The proprietary EBDW technology developed by e-Shuttle significantly lowers
the cost of prototyping ICs and reduces turnaround time.
    Under the new initiative, HKSTP will provide development support,
including design tools, evaluation systems, and a secured remote access design
environment to design houses, which then send timing, power and other data to
ESI for prototyping using the EBDW technology. The IC designers evaluate the
design or product prototypes from e-Shuttle for recommendation to
manufacturers. This process will allow even small and medium-sized design
organizations to leverage leading prototyping technologies such as 65nm at
very low cost.
    The program with e-Shuttle complements HKSTP's IC Design Centre, which
incorporates a wide range of IP services, including test development, IP
trial, licensing, integration and verification -- plus a legal framework for
semiconductor intellectual property development under an ISO 27001 certified
design environment.
    e-Shuttle was established by Fujitsu Microelectronics Limited and
Advantest Corporation to provide low-cost prototyping services for
leading-edge, large-scale ICs. e-Shuttle extends FML's silicon shuttle
operations with its proprietary EBDW technology.
    "Our cooperation with e-Shuttle will enable us to provide small and
medium-sized technology developers with access to the most advanced
prototyping technologies and FML's superior wafer manufacturing, as well as a
one-stop-shop service for design start and production release, governed by
global best practices and the rule of IP protection laws of Hong Kong," said
Ir. S.W. Cheung, Hong Kong Science Park's Vice President for Business
Development and Technology Support.
    The new partnership supports the rapid growth of Asia's semiconductor
industry, and the shift of IC design from the U.S. and Europe to this region.
According to e-Shuttle President Dr Haruo Tsuchikawa: "Working together with
HKSTP, we will activate new innovation by design houses in the semiconductor
industry. HKSTP has the manufacturing support environment that start-ups need.
Its secure information security system, together with our technology, is
critical to leading-edge IC development.
    "Prototyping advanced ICs is usually very costly, including the high cost
of reticle lithography. EBDW technology provides a short delivery cycle at
less cost with mask-less production," continued Tsuchikawa.
    "Since its establishment in 2001, HKSTP has been dedicated to IC and
associated silicon IP development by forming strong alliances with key IT
vendors, professional IC associations as well as leading universities," said
Cheung. "This cooperation with e-Shuttle further extends our technology
portfolio network to Japan."
    About Hong Kong Science and Technology Parks Corporation
    Hong Kong Science and Technology Parks Corporation ("HKSTP") is a
statutory body set up by the Government of the Hong Kong SAR. HKSTP provides
innovative and technology driven infrastructure and support facilities which
includes market-focused clustered laboratory services enabling Hong Kong
industries and services to be more competitive; a full-service incubation
programme for technology and design start-ups; and fosters partnerships and
collaboration between industry and universities/applied research institutes
through consulting, training and research programmes. HKSTP offers advanced
facilities and support services for high technology companies that include an
IC Design Centre, an IC Development Support Centre, a Materials Analysis
Laboratory, a Wireless Communications Test Laboratory and an Intellectual
Property Servicing Centre.
    HKSTP provides one-stop service for IC development, to offer technical
support covering the entire process from design to production, backed by a
team of seasoned and professional engineers with combined experience of more
than 500 person-years.
    More information about HKSTP is available at http://www.hkstp.org
    About e-Shuttle
    Headquartered in Kawasaki, Japan, e-Shuttle, Inc. was founded by Fujitsu
Microelectronics Limited and Advantest Corporation on November 1, 2006, to
develop EBDW technologies for 90-, 65- and 45-nanometer process technologies,
and to establish and offer semiconductor prototyping services, SiExpress(TM).
(See the press release dated October 30, 2006.) For more information, visit

For further information:

For further information: Pauline Ko of Hong Kong Science and Technology
Parks Corporation, (852) 2629 6710, pauline.ko@hkstp.org; or Joyce Mok of
Upstream Asia, (852) 2973 0222, hkstp@upstreamasia.com; or Emi Igarashi,
+1-408-737-5647, eigarash@fma.fujitsu.com, for e-Shuttle Web Site:
http://www.e-shuttle.co.jp                 http://www.hkstp.org

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