ZTE Selects Tundra Semiconductor for Next Generation Platform



    Tundra's PCI Express Product Brings Maximum Performance to New Graphics
    Card

    OTTAWA, Aug. 27 /CNW Telbec/ - Tundra Semiconductor Corporation
(TSX:TUN), a leader in System Interconnect, has been selected by ZTE
Corporation, a leading global provider of telecommunications equipment and
network solutions, to supply Tundra's high performance PCI Express(R) product
for ZTE's Next Generation Platform System Graphics Card.
    ZTE selected Tundra's high performance semiconductor to improve overall
performance on its new Graphics Card. Tundra's high performance semiconductor
has typical power consumption of 1.3W, and incorporates power management to
minimize power consumption during operation. In addition, the Tundra's PCI
Express product offers the flexibility, high performance, small footprint, low
power consumption and drop-in compatibility that ZTE required for its new
design.
    "Tundra's high performance PCI Express semiconductor is the best fit for
ZTE's Next Generation Platform Graphics Card. Our engineers evaluated several
other products available on the market and found that Tundra offered the best
performance and power against the competition. Our designs require the best
technology to solve our customers' needs and Tundra's interconnect solutions
are the best the market has to offer," said Mr. Zhu Baowang, Project Manager,
Design and Development Dept., Central Research Institute, ZTE . "The design
support provided by Tundra is second-to-none in the industry and ZTE continues
to rely on Tundra's industry-leading interconnect expertise."
    "We are proud to work with ZTE on their new designs. Tundra is committed
to the expanding China market and we are pleased to partner with global
leaders such as ZTE to bring new technologies to the industry," said Daniel
Hoste, President and Chief Executive Officer, Tundra Semiconductor. "Tundra's
PCI Express products offer the best performance features on the market today
and are backed by Tundra's world-class design support tools, development
platforms and customer support," continued Hoste.

    About ZTE

    ZTE is a leading global provider of telecommunications equipment and
network solutions. The ZTE product range is the most complete in the world -
covering virtually every sector of the wireline, wireless, service and
terminals markets. The company delivers innovative, custom-made products and
services to customers in more than 135 countries, helping them to achieve
continued revenue growth and to shape the future of the world's
communications. ZTE commits around 10% of annual turnover to research and
development and takes a leading role in a wide range of international bodies
developing emerging telecoms standards. It is the fastest growing telecoms
equipment company in the world, and is China's only listed telecoms
manufacturer, with shares publicly traded on both the Hong Kong and Shenzhen
Stock Exchanges. In the Asian Wall Street Journal's Readers' Survey 2007, ZTE
was among the Top 10 Most Admired Companies in China, the only company that
was included in the Top 10 list representing the telecom industry. ZTE was
awarded the "Most Promising Vendor of the Year" by Frost & Sullivan in its
2007 Asia Pacific ICT Awards, and was reported as the fastest growing telecom
equipment and solutions provider among the major telecom vendors worldwide by
IDC in 2007. ZTE was included in BusinessWeek's 2006 ranking of China's
Top 20 Brands. For more information, please visit www.zte.com.cn.

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with System Interconnect
products, intellectual property (IP) and design services backed by world-class
customer service and technical support. Tundra's track record of product
leadership includes over a decade of bridges and switches enabling key
industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), Power
Architecture(TM), VME, HyperTransport(TM), Interlaken, and SPI4.2. Tundra's
products deliver high functional quality and simplified board design and
layout, with specific focus on system level signal integrity. Tundra's design
services division, Silicon Logic Engineering, Inc., offers industry-leading
ASIC and FPGA design services, semiconductor intellectual property and product
development consulting. Tundra's technology connects critical components in
high performance embedded systems around the world. For more information,
please visit www.tundra.com.
    TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor
Corporation in Canada, the United States, the European Union and the People's
Republic of China. Design.Connect.Go. are trademarks of Tundra Semiconductor
Corporation. Other registered and unregistered trademarks are the property of
their respective owners.

    (C) Copyright 2008 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.




For further information:

For further information: Keri Zeran, Director Marketing Communications,
(613) 592-0859 ext. 1744, Mobile: (613) 697-6788, keri.zeran@tundra.com;
Mr.Zhu Baowang, Project Manager, Design & Development Dept., Central Research
Institute, ZTE Co.,Ltd., +86-25-52877483, Mobile: +86-13951899070,
zhu.baowang@zte.com.cn

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