Zarlink Joins Consortium Developing "Smart Flex" Packaging for the Miniaturization of Electronic Systems



    
    - European Commission-funded SHIFT Project focusing on highly integrated,
      mechanically flexible electronic systems
    

    CALDICOT, UK, April 11 /CNW Telbec/ - Zarlink Semiconductor (NYSE/TSX:ZL)
today announced that it has joined the SHIFT Project (Smart High-Integration
Flex Technologies). Co-funded by the European Commission, the project is
developing flexible, highly integrated packages for emerging electronic
systems, including medical devices, portable communication tools, smart cards
and aerospace applications.
    The SHIFT Project consortium consists of R&D institutes, industrial flex
manufacturers, end-users and a technology support agency. Zarlink's
participation in the SHIFT Project is based in its Caldicot, UK site. The
company's work will be initially focused on developing flexible packaging
technology for the personal medical device market. The first SHIFT enabled
product demonstrator from Zarlink will be available in the summer of 2007.
    With the increase in electronics systems that are located near, on or
even implanted in patients, product manufacturers are seeking lightweight,
flexible and compact designs to increase product functionality, user comfort
and convenience. The embedding of components in flexible materials such as
polyimides will be used as the basis of these products. To boost the
combination of high functionality and compactness as well as user comfort,
there is a need for substantial development in the use of embedded components
in flex substrates.
    "Medical electronic systems that move along with the user increasingly
require more functionality, and must be extremely small, lightweight and
available at a reasonable price," said David Hatherall, external project
leader at Zarlink's Caldicot facility. "This trend is just starting and it's
clear that we need to advance 'smart' packaging technology, which means
developing a flexible multilayer structure supporting multiple functions."
    Zarlink's Caldicot facility is a leader in advanced micropackaging
solutions for medical, high reliability and security markets. It offers unique
solutions that give customers the flexibility to incorporate a higher
component count and greater functionality in a smaller space than what is
typically found in conventional electronic assemblies.

    For more information about SHIFT, please visit
    http://www.shift-project.org/.

    About Zarlink Semiconductor

    For over 30 years, Zarlink Semiconductor has delivered semiconductor
solutions that drive the capabilities of voice, enterprise, broadband and
wireless communications. The Company's success is built on its technology
strengths including voice and data networks, optoelectronics and ultra
low-power communications. For more information, visit www.zarlink.com.

    Shareholders and other individuals wishing to receive, free of charge,
copies of the reports filed with the U.S. Securities and Exchange Commission
and Regulatory Authorities, should visit the Company's web site at
www.zarlink.com or contact Investor Relations.

    Certain statements in this press release constitute forward-looking
statements within the meaning of the Private Securities Litigation Reform Act
of 1995. Such forward-looking statements involve known and unknown risks,
uncertainties, and other factors which may cause the actual results,
performance or achievements of the Company to be materially different from any
future results, performance, or achievements expressed or implied by such
forward-looking statements. Such risks, uncertainties and assumptions include,
among others, the following: rapid technological developments and changes; our
ability to continue to operate profitably and generate positive cash flows in
the future; our dependence on our foundry suppliers and third-party
subcontractors; order cancellations and deferrals by our customers; increasing
price and product competition; and other factors referenced in our Annual
Report on Form 20-F. Investors are encouraged to consider the risks detailed
in this filing.

    Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink
Semiconductor Inc.




For further information:

For further information: Ed Goffin, Media Relations, (613) 270-7112,
edward.goffin@zarlink.com; Mike McGinn, Investor Relations, (613) 270-7210,
mike.mcginn@zarlink.com

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