Tundra's RapidIO Switch Selected by Texas Instruments for Beyond3G Wireless Infrastructure AMC Platforms



    TI Board Offers Wireless Designers 10 Gbps RapidIO Interconnect, Chip-to-
    Chip and Across the Backplane

    OTTAWA, June 4 /CNW Telbec/ - Tundra Semiconductor Corporation (TSX:TUN),
a leader in System Interconnect, announced today that Texas Instruments, Inc.
(TI) has selected the Tsi574(TM) RapidIO(R) Switch to cluster TI's wireless
infrastructure optimized DSPs on their TMS320TCI6484 AMC evaluation platform.
The 1 GHz TCI6484 single core DSP and evaluation module, launched in February
for select TI customers, targets Beyond3G applications including HSPA/HSPA+,
LTE and WiMAX Wave 2.
    The evaluation module includes Tundra's Tsi574 RapidIO Switch to
interconnect TI's processors on the board, leveraging Tundra's high
performance interconnect capability and Tundra's interoperability track record
with TI's suite of high bandwidth DSPs.
    "The Tundra Tsi574 pairs nicely with the TCI6484 evaluation module," said
Ramesh Kumar, marketing director for TI's wireless infrastructure business
unit. "The Tsi574 switch offers 10Gpbs of interconnect across the board,
enabling rapid processing for data-intensive applications."
    High bandwidth applications, such as wireless infrastructure designs,
require multiple high performance DSPs for data processing. Tundra's RapidIO
Switch technology allows multiple DSPs on a single board to pass high
bandwidth data at maximum transfer rates.
    As wireless infrastructure designs strive to keep up with the increasing
demands of bandwidth intense applications, such as the transfer of video,
music, and images, next generation base station OEMs must consider scalability
and maximum performance requirements.

    Availability

    Tundra's Tsi574 is available at www.tundra.com/sales

    About Tundra RapidIO(R) Switches

    Tundra switches provide chip-to-chip interconnect between RapidIO
end-points and can replace existing proprietary backplane fabrics for
board-to-board interconnect. As a founding member of the RapidIO Trade
Association and long-time Steering Committee member, Tundra continues to
provide leadership in the development of the RapidIO standard and was the
first semiconductor vendor to bring Parallel and Serial RapidIO switches to
market. RapidIO is the leading serial interconnect standard for embedded
systems and is supported by industry leaders such as, Alcatel- Lucent
Technologies, AMCC, EMC Corporation, Ericsson, and Freescale Semiconductor.
The Tundra family of RapidIO switches includes the Tsi620(TM), Tsi578(TM),
Tsi576(TM), Tsi574(TM), Tsi572(TM), Tsi568A(TM), and Tsi564A(TM).

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), Power Architecture(TM), VME, HyperTransport(TM),
Interlaken, and SPI4.2. Tundra's products deliver high functional quality and
simplified board design and layout, with specific focus on system level signal
integrity. Tundra's design services division, Silicon Logic Engineering, Inc.,
offers industry-leading ASIC and FPGA design services, semiconductor
intellectual property and product development consulting. Tundra's technology
connects critical components in high performance embedded systems around the
world. For more information, please visit www.tundra.com.

    TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor
Corporation in Canada, the United States, the European Union and the People's
Republic of China. Design.Connect.Go. and Tsi574 are trademarks of Tundra
Semiconductor Corporation. RapidIO is a trademark of the RapidIO Trade
Association Inc. Other registered and unregistered trademarks are the property
of their respective owners.

    Development of the Tsi574(TM) was made possible in part with the
assistance of the Technology Partnerships Canada Program.

    (C) Copyright 2008 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.




For further information:

For further information: North America: Keri Zeran, Director Marketing
Communications, 1-613-592-0859 ext. 1744, Mobile: 1-613-697-6788,
keri.zeran@tundra.com

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TUNDRA SEMICONDUCTOR CORPORATION

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