Tundra Semiconductor Offers RapidIO(R) Endpoint IP



    Tundra Enables RapidIO(R) Ecosystem Evolution with Endpoint IP

    DALLAS, TX, and OTTAWA, ON, March 7 /CNW Telbec/ - Tundra Semiconductor
Corporation (TSX:TUN), the leader in System Interconnect, is now developing
RapidIO(R) Endpoint IP for license. RapidIO offers a high performance,
packet-oriented interconnect protocol and Tundra's RapidIO IP offers designers
low risk and accelerated time-to-market.
    This announcement marks yet another first for Tundra, and further
strengthens Tundra's leadership position. Tundra announced the industry's
first Serial RapidIO switch in 2005 and subsequently launched the world's
first RapidIO interoperability lab in 2006. Tundra's RapidIO offering is now
expanded as its family of industry-leading switches and first-to-market
development platforms are accompanied by Endpoint IP. Customers can access a
full service RapidIO solution from Tundra.
    Customers are requesting access to Tundra's RapidIO intellectual property
as they build products based on Tundra's leading family of RapidIO switches.
Tundra's RapidIO Endpoint IP will, therefore, be made commercially available
to system developers, semiconductor manufacturers, FPGA and ASIC vendors and
their customers. The RapidIO Endpoint IP will be used to create custom and
standard product functions that further enlarge the RapidIO product ecosystem.
    "We believe Tundra's RapidIO Endpoint IP license will enable base station
OEMs to speed their time to market," said Travis Scheckel, TI's RapidIO
Development Manager and Chair of the RapidIO Technical Working Group. "RapidIO
continues to gain momentum in the wireless infrastructure marketplace, and its
value will become more critical as data-intensive applications proliferate.
Tundra's RapidIO switches and IP, coupled with TI's performance-leading family
of optimized DSPs, will continue to drive 3G applications and beyond."
    Tundra's offering is unique in the industry and features distinct
advantages. Through Tundra's experienced design services division, Silicon
Logic Engineering (SLE), the logic layer of the Serial RapidIO Endpoint IP can
be configured to meet individual customer's specific requirements. By
utilizing SLE design services, customers can save their internal resources for
their own proprietary design work.
    Another significant advantage to using Tundra's RapidIO IP is the
guaranteed interoperability that the licensed IP will offer. Tundra IP has
been proven to interoperate with multiple vendor DSPs, FPGAs, and ASICs.
Designers eliminate risk by adopting Tundra's Serial RapidIO switches, and
RapidIO IP which has been licensed from Tundra.
    "RapidIO has taken root, the ecosystem has evolved and there is now a
high demand for licensed RapidIO Endpoint IP. Once again Tundra has answered
an ecosystem need and provided an innovative solution to meet customer
requirements," said Tom Cox, Executive Director RapidIO Trade Association.

    Product Features

    The Endpoint IP enables high performance Serial RapidIO system
interconnect between processors, bridges, remote memories, customer defined
endpoint devices and Tundra RapidIO switches. The IP is compliant with RapidIO
Interconnect Specification (Revision1.3) and supports up to 10 Gbps payload.
Fully synthesizable, the IP is designed to be combined with technology
specific SerDes on multiple process technologies. Go to
www.tundra.com/RapidIOIP for additional feature information.

    Product Availability

    The Tundra RapidIO IP will be made available through Silicon Logic
Engineering (SLE, a division of Tundra) sales network sales@siliconlogic.com
or call SLE at 1-908-580-1870.

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), PowerPC(R), VME, HyperTransport(TM), Interlaken,
and SPI4.2. Tundra's products deliver high functional quality and simplified
board design and layout, with specific focus on system level signal integrity.
Tundra's design services division, Silicon Logic Engineering, Inc., offers
industry-leading ASIC and FPGA design services, semiconductor intellectual
property and product development consulting. Tundra's smart technology
connects critical components in high performance embedded systems around the
world. For more information, please visit www.tundra.com.

    About Silicon Logic Engineering

    Silicon Logic Engineering, Inc. (SLE) specializes in right-first-time
design services that address all aspects of ASIC, FPGA and semiconductor
system design services. SLE's proven and repeatable Think Physical(TM) design
process, tools and semiconductor intellectual property reduce time-to-market
and are provided by one of the most experienced VLSI design services teams in
the industry. SLE is a division of Tundra Semiconductor Corporation (TSX:TUN).
For more information about SLE, please visit http://www.siliconlogic.com.

    TUNDRA is a registered trademark of Tundra Semiconductor Corporation
    (Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks
    of Tundra Semiconductor Corporation in Canada, the European Union and the
    People's Republic of China (Registration is pending in the United
    States). Design.Connect.Go. are trademarks of Tundra Semiconductor
    Corporation. RapidIO is a registered trademark of the RapidIO Trade
    Association, Inc. Other registered and unregistered trademarks are the
    property of their respective owners.

    (C) Copyright 2007 Tundra Semiconductor Corporation. All rights reserved.
    Information subject to change without notice.




For further information:

For further information: North America: Keri Zeran, (613) 697-6788,
Keri.zeran@tundra.com; Europe: Rob Davies, + 44 (0)1225 470000,
rob.davies@publitek.com; China: Jo Soo, + 852.2837.4727, jo.soo@edelman.com

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TUNDRA SEMICONDUCTOR CORPORATION

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