TSMC Unified DFM Architecture Promises Improved Yields and Accelerated Time-to-Market



    
    First steps toward 32nm developed through design ecosystem collaboration
    

    HSINCHU, Taiwan, June 9 /CNW/ -- Taiwan Semiconductor Manufacturing
Company, Ltd. (TSE: 2330) (NYSE:   TSM) today unveiled a new Unified Design For
Manufacturing (UDFM) architecture that targets 32nm process technology and
smaller geometries and improves yields, lowers design costs and accelerates
time-to-market and time-to-volume.
    The newly-created UDFM provides a unified, encapsulated access to TSMC
foundry data and was developed in collaboration with EDA vendors and other
design infrastructure partners. The TSMC UDFM is also one of the key
collaborative components of the company's recently unveiled Open Innovation
Platform(TM). Open Innovation Platform(TM) is a platform for innovations,
hosted by TSMC and open to TSMC customers and partners. It is built on TSMC's
design-enabling building blocks and an ecosystem interface.
    The TSMC UDFM architecture includes a new DFM Design Kit (DDK) that, for
the first time encapsulates, an embedded DFM software engine with an
interoperable API in addition to the process-related DFM data and models. UDFM
brings an exact copy of TSMC's factory tool chain and process models into IC
design tool chains, providing chip designers with deeper access into more of
TSMC's manufacturing data than ever before.
    This "copy exact" method compensates for increasing manufacturing
variances in advanced process technologies, radically improves design
alignment between simulated hotspots and actual manufacturing hotspots, and
delivers timely accuracy to the design ecosystem. The new DFM architecture
handles very large DFM dataset and design complexity, resulting in reduced
design cycle time and faster time-to-market and volume.
    "TSMC is laying the groundwork for 32nm process technologies with the
industry's first Unified DFM framework," said S.T. Juang, senior director of
design infrastructure marketing at TSMC.  "Through deep and extensive DFM data
mining and collaborative development with our design ecosystem partners, TSMC
UDFM allows our customers access to accurate manufacturing representation,
enabling next generation chip designs to take full advantage of our advanced
nanometer process technologies."
    
    Availability
    
    TSMC's Unified DFM DDK will be available in early Q3 2008 to registered
members through the TSMC customer portal.
    
    TSMC Open Innovation Platform(TM)
    
    Unified DFM is a component of TSMC's Open Innovation Platform(TM), that
promotes the speedy implementation of innovation among the semiconductor
design community, TSMC's ecosystem partners, and  the company's IP, design
implementation, DFM capabilities, process technology, and backend services.  A
key element of the Open Innovation Platform(TM) is a set of ecosystem
interfaces and collaborative components initiated and supported by TSMC that
more efficiently empowers innovation throughout the supply chain and enables
the creation and sharing of newly created value. TSMC's Active Accuracy
Assurance (AAA) initiative is a critical part of the Open Innovation
Platform(TM), providing the accuracy and quality required by the ecosystem
interfaces and collaborative components.
    
    About TSMC
    
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry industry's largest
portfolio of process-proven libraries, IP, design tools and reference flows.
The Company's total managed capacity in 2007 exceeded eight million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GigaFabs(TM)
four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please see http://www.tsmc.com and http://blog.tsmc.com.
    Open Innovation Platform(TM) is a trademark of TSMC




For further information:

For further information: Chuck Byers of Taiwan Semiconductor
Manufacturing  Company, Ltd., +1-408-382-7919 Web Site: http://www.tsmc.com

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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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