TSMC Reports Foundry's First 32-Nanometer Technology With Functional SRAM



    HSINCHU, Taiwan, R.O.C., Dec. 11 /CNW/ -- Taiwan Semiconductor
Manufacturing Company (TSE: 2330; NYSE:   TSM) today announced it has developed
the first 32-nanometer (nm) technology that supports both analog and digital
functionality. The company made its announcement through a paper presented at
today's IEEE International Electron Devices Meeting in Washington, DC. The
paper also revealed that the company had proven the full functionality of the
2Mb SRAM test chip with the smallest bit-cell at the 32nm node.
    This leading edge technology is optimized for low power, high density and
manufacturing margins with optimal process complexity. Low power technology
integrated with high density SRAM, low standby transistors, analog and RF
functions, and copper and low-k interconnects is ideal for system on chip
(SoC) devices targeted in mobile applications. TSMC plans to provide complete
digital, analog and RF functions, and high density memory capabilities at 32nm
node.
    Noteworthy in the announcement is the fact that this is the first 32nm
low-power technology that did not have to resort to high-k gate dielectric and
metal gates to achieve its performance characteristics. In addition, a
0.15um(2) high density SRAM cell has been realized by 193nm immersion
lithography using double patterning approach.
    "With this announcement, TSMC continues to lead the industry by pushing
the boundaries of advanced technology," said Dr. Jack Sun, vice president R&D,
TSMC. "The achievement made at 32nm technology node is yet another testimony
to our long-term investment and commitment in advanced technology development
to help our customers bring their leading-edge products first to market."
    
    About TSMC
    
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry industry's largest
portfolio of process-proven libraries, IP, design tools and reference flows.
The Company's total managed capacity in 2006 exceeded seven million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GigaFabs,
four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 65nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please see http://www.tsmc.com




For further information:

For further information: Chuck Byers, TSMC Brand Management, 
+1-408-382-7919, cbyers@tsmc.com, or JH Tzeng, Corporate Public Relations, 
+886-3-505-5028, jhtzeng@tsmc.com, both of Taiwan Semiconductor Manufacturing 
Company Web Site: http://www.tsmc.com

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