Area reduction and performance gain with slim platform for analog and
power management system-on-chip applications
HSINCHU, Taiwan, R.O.C., June 29 /PRNewswire-FirstCall/ -- Taiwan
Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today
announced that it has released an enhanced version of its 0.13-micron process
to benefit customers' cost and competition and to enable the integration of
power management functions. The 0.13-micron/0.11-micron family now includes a
slim standard cell, SRAM and I/O with substantial area reduction and the
0.13-micron process also adopts LD-MOS (5V~20V) on RF platforms to enable
analog and power management applications. The slim platform is available in
the third quarter this year while the LD-MOS on RF platforms will be available
in Q4 this year.
To meet the ever shrinking requirements for basic consumer and RF
applications, the slim platform I/O area achieves a 30% reduction and SRAM bit
cells demonstrate a 25% reduction when compared with traditional offerings.
Furthermore, a 0.13-micron LD-MOS device built upon a RF platform enables SOC
designs with power management functionality.
"This is another example of how TSMC is committed to enabling more
efficient SoC design of wireless, consumer and communications devices using
0.13-micron process technology," said Dr. Simon Wang, senior director of
Advanced Technology Business Division. "The result of these enhancements will
spawn the next generation of innovation," he said.
TSMC's investment in R&D for technology and IP portfolios within the
0.13-micron/0.11-micron family now delivers a true 5V with Copper interconnect
for the integration of analog, high-speed DSP, power management and watt-scale
class-D amplification. Along with new features development for system-on-chip
design, TSMC also offers a shrunken path to enhance customer's competitiveness
including sub-node and slim technology platform.
TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent
wafers, including capacity from two advanced 12-inch - GIGAFABs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please visit http://www.tsmc.com.
For further information:
For further information: Wendy Matthews, TSMC North America,
+1-408-382-8030, JH Tzeng, Corporate Public Relations, 886-3-5055028 Web Site: