TSMC Announces Foundry's First Mixed Signal/RF Reference Design Kit



    Silicon-proven Reference Design Approach Accelerates RF Designs and
Enables Systems-on-Chip Integration
    

    
    HSINCHU, Taiwan, April 21 /PRNewswire-FirstCall/ -- Taiwan Semiconductor
Manufacturing Company, Ltd. (TSE: 2330; NYSE:   TSM) today unveiled the foundry
industry's first Mixed Signal/Radio Frequency  Reference Design Kit (MS/RF
RDK) at its North American Technology Symposium in San Jose. The RDK initially
targets 65nm process technology and aims to accelerate analog, mixed-signal,
and RF designs and RF SoC verification and integration. The MS/RF RDK is the
result of multi-year collaboration between TSMC and Cadence Design Systems and
represents one of the initial deliverables of the TSMC Open Innovation
Platform(TM).
    

    
    The new RDK helps resolve the long-standing challenge of full chip
verification of SoCs with both analog, mixed signal and digital content. It
enables a top-down MS/RF design methodology and a system-level simulation flow
to reduce design cycle time and encourage IP reuse. The reference design in
the RDK is an advanced Fractional-N Phase Locked Loop (PLL) developed in TSMC
65nm RF process technology and fully validated in silicon with accurate
correlation between simulation results and silicon measurements.
    

    
    The RDK includes a video tutorial and step-by-step design manual; the
complete PLL reference design database with schematics, layouts, and
simulation test benches; a design flow and methodology introduction; silicon
test reports, release notes specifying design tool and version requirements
and a TSMC 65nm process design kit (PDK).
    

    
    "Enhancing innovation in the MS/RF design space is one key initiative of
the TSMC Open Innovation Platform," explains ST Juang, senior director of
Design Infrastructure Marketing at TSMC. "The TSMC MS/RF RDK delivers a new
level of confidence to our customers that complex MS/RF blocks can be created
and accurately verified in the context of full chip RF SoCs, and taped out
with high quality, thus ensuring first-pass silicon success. We continue to
collaborate with our ecosystem partners to enhance the features and
capabilities of the RDK to address emerging MS/RF design challenges."
    

    Pricing and Availability

    
    The TSMC 65nm MS/RF RDK is available now in limited release and at no
charge to selective customers during Q2 2009. General release to other
customers is targeted for Q3 2009. Customers may access the MS/RF RDK at the
TSMC Online customer design portal http://online.tsmc.com/online/ or contact
their local sales and support representatives for details.
    

    About TSMC
    
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs
(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please visit http://www.tsmc.com.
    





    




For further information:

For further information: Wendy Matthews of TSMC North America,
+1-408-382-8030; or JH Tzeng, Corporate Public Relations, 886-3-666-5028, both
of TSMC Web Site: http://www.tsmc.com

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