Key process development achievement demonstrates gate-last approach
HSINCHU, Taiwan, R.O.C., Aug. 24 /CNW/ -- Taiwan Semiconductor
Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) has become the first
foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to
achieve it across all three 28nm nodes.
"Achieving 64Mb SRAM yield across all three 28nm process nodes is
striking. It is particularly noteworthy because this achievement demonstrates
the manufacturing benefits of the gate-last approach that we developed for the
two TSMC 28nm high-k metal gate processes," explained Dr. Jack Sun, vice
president, Research and Development at TSMC.
"This accomplishment underscores TSMC's process technology capability and
value in 28nm. It shows TSMC is not only able to extend conventional SiON
technology to 28nm, but is also able to deliver the right 28nm HKMG technology
at the same time," explained Dr. Mark Liu, senior vice president, Advanced
Technology Business at TSMC.
The TSMC 28nm development and ramp-up has remained on track since the
announcement made in September of 2008. The 28LP process is expected to enter
risk production at the end of Q1 of 2010, followed closely by the 28HP risk
production at the end of Q2 and the 28HPL risk production in Q3.
The 28nm LP process will serve as a fast time-to-market and low cost
technology ideal for cellular and mobile applications. The 28nm HP process is
expected to support devices such as CPUs, GPUs, Chipsets, FPGAs, networking,
video game consoles, and mobile computing applications that are performance
demanding. The 28nm HPL process features low power, low leakage, and
medium-high performance. It is aimed to support applications such as cell
phone, smart netbook, wireless communication and portable consumer electronics
that demand low leakage.
All 28nm TSMC processes feature a comprehensive design infrastructure
based on the company's Open Innovation Platform(TM) to extend the power of the
technology to a broad range of differentiating products.
TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IP, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent
wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four
eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC.
TSMC is the first foundry to provide 40nm production capabilities. Its
corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC
please visit http://www.tsmc.com.
For further information:
For further information: Wendy Matthews, TSMC North America,
+1-408-382-8030, Michael Kramer, Corporate Public Relations, 886-3-5636688,
ext., 7126216 Web Site: http://www.tsmc.com