SAN DIEGO, Aug. 17 /CNW/ -- RAYSPAN Corporation, the world's leading
innovator of metamaterial air interface solutions, is proud to announce it has
been granted a fundamental patent, ANTENNAS BASED ON METAMATERIAL STRUCTURES.
The sweeping claims of this patent encompass a broad range of metamaterial
inventions that make possible RAYSPAN's breakthrough ultra-miniature antennas
and related air interface components and systems. With an intellectual
property portfolio that now includes over sixty-five awarded and pending
domestic and international patents covering the world's most advanced
metamaterial wireless technology, RAYSPAN has established an extremely strong
foundation for licensing and protecting its metamaterial solutions in the
global cellular handset and wireless LAN markets. This unmatched patent
portfolio protects the full span of RAYSPAN's fundamental enabling structures,
antennas and essential radio frequency (RF) components based on those
structures, use of those structures in key RF subsystems and systems, and
complete end-to-end communication networks.
The air interface breakthroughs enabled by RAYSPAN's metamaterial
technology include ultra-compact implementations for broadband and multi-band
antennas, filters, couplers, diplexers, and duplexers for all wireless LAN and
cellular handset applications. In addition, the unique properties of
metamaterials enable highly integrated solutions, extending from miniaturized
antenna arrays, including MIMO, to complete RF front-end systems.
"RAYSPAN's innovations continue to be key in successfully implementing
today's advanced broadband wireless applications on a large scale," said Dr.
Maha Achour, Founder and Chief Technical Officer of RAYSPAN, Inc. "RAYSPAN's
ability to solve key RF challenges using its proprietary metamaterial
solutions is testimony to the power of the technology it has developed and its
ability to surpass all competing solutions in size, performance, and ease of
integration. Without any doubt, RAYSPAN will remain a technology leader
through its continuous innovations across the whole RF front-end landscape."
About RAYSPAN and Metamaterials:
The mission of RAYSPAN Corporation is to research, develop, market and
license the world's leading portfolio of proprietary metamaterial wireless air
interface solutions. Metamaterials are composite materials engineered to
produce desired electromagnetic propagation behavior not found in natural
media. They make possible breakthrough advances in air interface
miniaturization, performance and integration while simultaneously reducing
costs and simplifying manufacturing.
The wireless air interface is an essential part of every wireless device
and is comprised of the antenna(s) and RF front-end components: filters,
switches, couplers, diplexers, duplexers and power amplifiers. Today's air
interface presents some of the most challenging system integration problems
facing the wireless industry. As new standards call for utilizing multiple
radio bands, complex modulation schemes and multiple modes and channels, as in
MIMO systems, the size and spacing requirements of the components that
comprise the interface make it virtually impossible to achieve compact mobile
terminal size while maintaining adequate system performance.
RAYSPAN's metamaterial air interface solutions decisively solve these
problems. They enable ultra-compact, multi-band, multi-mode and/or MIMO WLAN
devices and cellular handsets with superior communication speed, range and
mobility at reduced costs. These solutions address virtually all segments of
the WLAN and handset markets, and they can be implemented quickly and
inexpensively under RAYSPAN's licensing model.
"Always increase customers' product value, decrease their costs and
simplify their business process"
For further information:
For further information: Brian Hurst, VP of Sales & Marketing of RAYSPAN
Corporation, +1-858-259-9596, ext. 306, email@example.com Web Site: