Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology



    TOKYO and HSIN-CHU, Taiwan, April 30 /CNW/ -- Fujitsu Microelectronics
Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330,
NYSE:   TSM) today announced that they will collaborate on leading-edge process
technology production for the manufacturing of Fujitsu Microelectronics'
products. Under an agreement between the companies, Fujitsu Microelectronics
will expand its 40-nanometer generation logic IC business with production at
TSMC's fabs.
    

    
    The collaborative effort will bring together Fujitsu Microelectronics' IC
design technologies, leading edge imaging and communication intellectual
property (IP), and high-quality technical support to customers, especially in
Japan, with TSMC's foundry-leading process technology and capability. This
advanced technology engagement should enable both companies to create new
business for themselves and for their prospective customers.
    

    
    The two companies also announced that they intend to initiate discussions
on collaborative development of high-performance process technologies for
28-nanometer and below for Fujitsu Microelectronics' product applications.
    

    
    "From the aspect of its advanced process technologies and large-scale
production capacity, TSMC is the most attractive semiconductor foundry
partner," said Haruki Okada, president of Fujitsu Microelectronics Limited.
"By continuing to create our advantages in fine-pitch process technologies
through this partnership, we can further grow our ASIC and ASSP (*1) product
businesses."
    

    
    "Fujitsu Microelectronics is clearly a world-class leader in advanced
high-speed and low-power technologies, design engineering, and differentiated
IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and
our on-going investment and dedication to advanced process technology, our
collaboration with Fujitsu Microelectronics represents a new best-in-class
solution for many system companies," said Dr. Rick Tsai, president & CEO of
TSMC.
    

    Notes:
    *1: ASIC and ASSP
    
    ASIC: Application specific IC. Customized ICs for specific applications
(customers).
    ASSP: Application specific standard products. IC products for specific
applications, such as image processing and network-related processing.
    

    

    
    Press Contacts:
    

    
    Fujitsu Limited
    Public and Investor Relations Division
    Inquiries:
    https://www-s.fujitsu.com/global/news/contacts/inquiries/index.html
    

    
    Taiwan Semiconductor Manufacturing Company, Ltd.
    Corporate Public Relations
    Michael Kramer
    Phone 886-3-563-6688 Ext. 712-6216
    

    
    TSMC Japan Limited
    Press Center
    c/o: E&E, Inc.
    Phone 81-422-30-8800

    Fujitsu Microelectronics Customer Inquiries:
    Management Promotion Office
    Fujitsu Microelectronics Limited
   
https://www-s.fujitsu.com/global/services/microelectronics/contact/form.html

    About Fujitsu Microelectronics Limited (FML)
    
    Fujitsu Microelectronics Limited designs and manufactures semiconductors,
providing highly reliable, optimal solutions and support to meet the varying
needs of its customers. Products and services include ASICs/COT, ASSPs, power
management ICs, and flash microcontrollers, with wide-ranging expertise
focusing on imaging, wireless, automotive and security applications. Fujitsu
Microelectronics also drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was established as a
subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and
development network, with sites in Japan and throughout Asia, Europe, and the
Americas, Fujitsu Microelectronics offers semiconductor solutions to the
global marketplace. For more information: http://jp.fujitsu.com/fml/en/
    

    About TSMC
    
    TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IPs, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs(TM),
four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please
visit www.tsmc.com.
    

    
    All company or product names referenced herein are trademarks or
registered trademarks of their respective owners. Information provided in this
press release is accurate at time of publication and is subject to change
without advance notice.
    




    




For further information:

For further information: Michael Kramer, Corporate Public Relations of
Taiwan Semiconductor Manufacturing Company, Ltd., 886-3-563-6688, ext.
712-6216; or Press Center of TSMC Japan Limited, c/o: E&E, Inc.,
81-422-30-8800 Web Site: http://jp.fujitsu.com/fml/en

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