Freescale and Tundra Semiconductor introduce development platform enabled by RapidIO(R)



    Multi-core MSC8144 DSP and Tsi578(TM) Serial RapidIO Switch combine to
    enable bandwidth-hungry broadband systems

    AUSTIN, TX and OTTAWA, ON, June 20 /CNW Telbec/ - Freescale
Semiconductor, a global semiconductor leader, and Tundra Semiconductor
Corporation (TSX:TUN), the leader in System Interconnect today introduced a
development platform that combines the industry's highest performing
programmable digital signal processors (DSPs) and the lowest power Serial
RapidIO (sRIO) switch available.
    The platform leverages Serial RapidIO interconnect technology, using
Tundra's Tsi578(TM) switch to cluster four Freescale MSC8144 multi-core DSPs
in an AMC single-width form factor. Tundra and Freescale created the solution
to address interconnect bandwidth requirements of up to 10 Gbps between
on-board components in key applications such as wireless base stations, radio
network controllers, media gateways, video conferencing and radar signal
processing. These processing-intensive applications require high-performance
DSPs and the high throughput, low latency characteristics of a RapidIO
solution.
    The Tsi578 switch is well suited to interconnect multiple Freescale
MSC8144 multi-core DSPs on a single channel card, enabling an advanced
solution that allows base station and media gateway manufacturers to achieve
optimal performance while spanning a wide range of air interfaces.
Interoperability between the two products has already been tested in Tundra
labs and leveraged for the development platform.
    "The MSC8144 and Tsi578 deliver a combined solution that is well suited
to address the challenges that manufacturers of high capacity infrastructure
equipment face today," said Jeff Timbs, Marketing Director for Freescale's
Networking Systems Division. "This reference design should prove to be a very
attractive option for customers seeking high-performance solutions for
communications infrastructure applications such as AdvancedTCA and MicroTCA."
    Tundra's Tsi578 enables low latency RapidIO interconnect capabilities at
up to 10 Gbps, thereby supporting the bandwidth-per-link requirements of key
applications. Freescale's MSC8144 multi-core DSP offers up to 10 Gbps per sRIO
port. Customers can take advantage of the benefits of this platform in
standalone mode within MicroTCA and ATCA systems, or alongside Tundra's
recently announced Tsi578 Serial RapidIO Development Platform.
    Tundra's Tsi578 has successfully passed interoperability testing to DIL-3
certification by RIOLAB, the world's only independent Serial RapidIO testing
facility. Additionally, Tundra and Freescale have proven RapidIO connectivity
between Tundra's Tsi578 and Freescale's MSC8144 across physical, logical and
transport layers.
    "The Tundra/Freescale solution offers the aggregate processing power to
implement 3G LTE, WiMAX and TD-SCDMA baseband as well as high density gateway
applications," said Daniel Hoste, President and Chief Executive Officer,
Tundra Semiconductor. "With the solution, system OEMs can maximize subscribers
per line card, while doing processing-intensive applications such as OFDM Phy
processing, and multi-channel video and voice compression. Leveraging Serial
RapidIO interconnect for both chip-to-chip as well as backplane interconnect,
wireless and wireline infrastructure designs can now take full advantage of
the bandwidth processing capability of Freescale's high performance DSP
clusters enabled by Tundra's Tsi578 switch."
    The MSC8144 takes single-chip DSP integration to a new level of
sophistication, combining four StarCore(R) DSP cores at up to 1GHz each and
delivering the industry's highest performance, equivalent to a 4GHz
single-core DSP. The device integrates a large embedded memory, enabling
higher throughput to memories than external DDR while reducing chip count and
BOM. The part leverages dual RISC QUICCEngine technology at 400MHz to offload
networking protocols, and it offers high speed interfaces such as the
x4 Serial RapidIO and dual SGMII Gigabit Ethernet interfaces.
    In February 2006, Tundra launched the Tsi578 Serial RapidIO Switch with
multicast capability, responding to designers' requirements for low
interconnect processing overhead, lowest power consumption, minimum latency as
well as board layout with high signal integrity. The Tsi578 supports the
1.3 RapidIO specification, and its broad feature set includes hardware
multicast, supervised traffic flow for increased performance and fabric
management, field-proven port flexibility which supports mixed port widths at
up to 10 Gbps data speeds, and enhanced SerDes for the lowest power switch
solution available.

    Tundra at Freescale Technology Forum in Orlando, Florida
    June 25 - 28, 2007

    Tundra will exhibit and demonstrate its comprehensive line of System
Interconnect products at the Freescale Technology Forum in Orlando, Florida
June 25-28. Tundra's Chief Technology Officer, Benny Chang, will participate
in a panel discussion titled "Trends in High Speed Interconnects" on
Wednesday, June 27.

    About Freescale Semiconductor

    Freescale Semiconductor is a global leader in the design and manufacture
of embedded semiconductors for the automotive, consumer, industrial,
networking and wireless markets. The privately held company is based in
Austin, Texas, and has design, research and development, manufacturing or
sales operations in more than 30 countries. Freescale is one of the world's
largest semiconductor companies with 2006 sales of $6.4 billion (USD).
www.freescale.com

    About Tundra

    Tundra Semiconductor Corporation (TSX:TUN) supplies the world's leading
communications, computing and storage companies with smart System Interconnect
products and design services backed by world-class customer service and
technical support. Tundra's track record of product leadership includes over a
decade of bridges and switches enabling key industry standards: RapidIO(R),
PCI, PCI-X, PCI Express(R), PowerPC(R), VME, HyperTransport(TM), Interlaken,
and SPI4.2. Tundra's products deliver high functional quality and simplified
board design and layout, with specific focus on system level signal integrity.
Tundra's design services division, Silicon Logic Engineering, Inc., offers
industry-leading ASIC and FPGA design services, semiconductor intellectual
property and product development consulting. Tundra's smart technology
connects critical components in high performance embedded systems around the
world. For more information, please visit www.tundra.com.

    Freescale(TM) and the Freescale logo are trademarks of Freescale
Semiconductor, Inc. All other product or service names are the property of
their respective owners. (C) Freescale Semiconductor, Inc. and Tundra
Semiconductor Corporation. 2007. All rights reserved. Information subject to
change without notice.

    TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation (Canada - registration in the United States,
European Union, and People's Republic of China pending). Tsi578, Tsi576,
Tsi574, Tsi568A, Tsi564A and Design.Connect.Go. are trademarks of Tundra
Semiconductor Corporation. RapidIO is a registered trademark of the RapidIO
Trade Association. Other registered and unregistered trademarks are the
property of their respective owners.
    Development of the Tsi578, Tsi576 and Tsi574 were made possible in part
with the assistance of the Technology Partnerships Canada Program.




For further information:

For further information: Tundra Media Contacts: Keri Zeran, Tundra
Semiconductor, (613) 697-6788, keri.zeran@tundra.com; Freescale Media
Contacts: North America: Jack Taylor, Freescale Semiconductor, (512) 996-5161
Office, (512) 560-7143 Mobile, jack.taylor@freescale.com; Europe, Middle East,
Africa: Laurent Massicot, Freescale Semiconductor, (33-16) 935-7712,
laurent.massicot@freescale.com; India: Madhusudan Bhaskaran, Freescale
Semiconductor, (91-80) 5665-8268, bhaskaran.madhusudan@freescale.com; Asia
Pacific: Gloria Shiu, Freescale Semiconductor, (85-22) 666-8237,
gloria.shiu@freescale.com; Japan: Masako Tanikawa, Freescale Semiconductor,
(81-3) 5437-9128, masako.tanikawa@freescale.com; Latin America: Dale Weisman,
Freescale Semiconductor, (512) 895-2795, dale.weisman@freescale.com

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TUNDRA SEMICONDUCTOR CORPORATION

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