e-Shuttle to Feature Its Electron-Beam Direct Write (EBDW) Technology at GSA Suppliers Expo Oct. 2 in Santa Clara



    
    EBDW Applications Now Ready at 65nm and 90nm Implementation to Reduce
    Costs, Delivery Cycles Using Mask-less Production

    
    SUNNYVALE, Calif., Sept. 30 /CNW/ -- e-Shuttle, Inc., the company
established by Fujitsu Microelectronics Limited and Advantest Corporation to
provide prototyping services for leading-edge, large-scale ICs, will feature
its Electron-Beam Direct Write (EBDW) technology at the GSA Suppliers Expo &
Conference in the Santa Clara Convention Center, October 2.
    In booth 701, e-Shuttle will show a 300mm wafer developed using its
industry-leading 65nm technology, along with a complete roadmap highlighting
current features and future developments.  e-Shuttle is now offering the EBDW
technology for manufacturing 65nm CMOS logic ICs, which represents the first
full-scale application of EBDW techniques for complex devices.  The company is
also successfully applying EBDW technology for devices using 90nm process
technology, manufacturing structured ASICs for fabless semiconductor
companies.  Producing single-layer via interconnect patterns using EBDW
provides a short delivery cycle with mask-less production, with yields
comparable to optical lithography.
    The 300mm wafer shuttle service -- in which wafer delivery combines the
orders of multiple customers -- reduces costs.  Via layers are formed using
EBDW, reducing the significant costs involved in forming via layers for
ultra-fine interconnects using masks.  The EBDW technology has achieved
excellent results without compromising yield, demonstrating that EB
lithography and ArF lithography can coexist in the fabrication process.
    The e-Shuttle F3000 system features a short focal length lens that
reduces coulomb interaction when beam current density is high.  The F3000 also
can project as many as 100 different patterns in a single block area, with a
total of 12 blocks available for the user. In addition, in-situ cleaning
eliminates the risk of contamination and assures high up-time operation.
    
    About e-Shuttle
    
    Headquartered in Kawasaki, Japan, e-Shuttle, Inc., was founded by Fujitsu
Microelectronics Limited and Advantest Corporation on November 1, 2006, to
develop EBDW technologies for 90-, 65- and 45-nanometer process technologies,
and to establish and offer semiconductor prototyping services, SiExpress(TM).
For more information, visit http://www.e-shuttle.co.jp
    All company and other product names mentioned may be trademarks or
registered trademarks of their respective owners.




For further information:

For further information: media, Emi Igarashi, 1-408-737-5647,
eigarash@fma.fujitsu.com; or eShuttle, Takahisa Takanoe, +81-44-754-2550, fax,
+81-44-754-2551, takano.takahisa@ip.fujitsu.com, both for e-Shuttle, Inc. Web
Site: http://www.fma.fujitsu.com                 http://www.e-shuttle.co.jp

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E-SHUTTLE, INC.

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