Dynex Power Delivers World's First Hermetic, Dynamic Load Balancing, Press-pack IGBT

Listing: TSX Venture Exchange
Symbol: DNX

LINCOLN, England, July 19, 2017 /CNW/ - Dynex Power Inc. (TSXV: DNX), a leading manufacturer of high power semiconductors and electronic equipment, is pleased to announce a significant industry-leading achievement: the initial delivery of the world's first hermetic, dynamic load balancing, Press-pack IGBT.

Mr. Clive Vacher, President and Chief Executive Officer commented, "The design features of the new Dynex Press-pack IGBT deliver market-leading performance and reliability, even in the most extreme conditions.  This product is unique in the marketplace.  It encompasses the most technologically-advanced design of any press-pack in the world, and provides a new benchmark of performance in the industry.  Furthermore, it is designed for a wide range of customer applications: it will not only provide a more effective solution to existing and new-design press-pack based systems, but also open up new industries to the benefits of switching to press-pack technology."

The Dynex Press-pack IGBT range offers the following advantages over traditional press-pack IGBTs:

  1. Dynamic load balancing, ensuring uniform contact pressure for optimum current sharing and reliability.
  2. Mechanical overload protection.
  3. Suitability for use with standard pressure contact device clamps and heatsinks.
  4. Compact construction for market-leading current density.

The Dynex Press-pack IGBT range is based on a flexible, scalable design, making it straightforward to produce devices with a variety of contact diameters, current ratings and IGBT:FRD chip ratios.  Dynex's chip design and in-house fabrication capabilities make it possible to tune chipsets to specific applications. 

Dynex Press-pack IGBT devices are now available at a variety of power levels up to 3000A at 4500V, making Dynex the ideal partner for both new and existing designs.  Further growth up to 4000A and beyond will be available later this year.

Forward-looking Statements
In commenting on its expectations, the Company cautioned existing and potential shareholders about relying on the Company's expectations in that the Company's expectations contain forward looking statements and assumptions which are subject to the risks and uncertainties of the markets and the future, which could cause actual results to differ materially from expectations, and which are each difficult and subjective to forecast. Certain of those risks and uncertainties are discussed in the Management's Discussion and Analysis for the quarter ended March 31st , 2016 and include, among other things, risks and uncertainties relating to: the level of worldwide demand for power semiconductors and power semiconductor assemblies; the level of investment in power electronic equipment, electrification of transport systems, alternative power generation and high quality power transmission and distribution; and fluctuations in exchange rates between Canadian Dollars, Sterling, US dollars and Euros. As a consequence of these and other risks and uncertainties, shareholders and potential investors must make their own independent judgments about the accuracy and reliability of the Company's expectations. Dynex disclaims any intention or obligation to update or revise any forward looking statement whether as a result of new information, future events or otherwise.

About the Company
Dynex designs and manufactures high power bipolar semiconductors, high power insulated gate bipolar transistor (IGBT) modules and die, high power electronic assemblies and radiation hard silicon-on-sapphire integrated circuits (SOS IC's). The company's power products are used worldwide in power electronic applications including electric power transmission and distribution, renewable and distributed energy, marine and rail traction motor drives, aerospace, electric vehicles, industrial automation and controls and power supplies. The Company's IC products are used in demanding applications in the aerospace industry. Dynex Semiconductor Ltd is its only operating business and is based in Lincoln, England in a facility housing the fully integrated silicon fabrication, assembly and test, sales, design and development operations.  In 2008, a majority of the shares of Dynex were acquired by Zhuzhou CSR Times Electric Co., Ltd. In April 2016 this company changed its name to Zhuzhou CRRC Times Electric Co., Ltd.

Zhuzhou CRRC Times Electric Co., Ltd. is based in Hunan Province in the People's Republic of China. It is listed on the Hong Kong Stock Exchange. CRRC Times Electric is mainly engaged in the research, development, manufacture and sales of locomotive train power converters, control systems and other train-borne electrical systems, as well as the development, manufacturing and sales of urban railway train electrical systems. In addition, CRRC Times Electric is also engaged in the design, manufacturing and sales of electric components including power semiconductor devices for the railway industry, urban railway industry and non-railway purposes.

Press announcements and other information about Dynex are available at www.dynexpower.com.

Further information on CRRC Times Electric can be found at www.timeselectric.cn/en

All monetary values expressed in this release are in Canadian Dollars unless stated otherwise.

The TSX Venture Exchange has neither approved nor disapproved of the information in this press release.

 

SOURCE Dynex Power Inc.

For further information: Clive Vacher, President and Chief Executive Officer, Dynex Power Inc.; Neil Sellars, Sales and Marketing Manager, Tel: +44 1522 500 500, Email: investorrelations@dynexsemi.com

RELATED LINKS
http://www.dynexsemi.com

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